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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
6022BG

6022BG

HEATSINK TO-220 STAGGERED FIN

Boyd Laconia, LLC

17,836 -
6022BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.210" (30.73mm) 0.875" (22.22mm) - 0.250" (6.35mm) Bolt On and PC Pin 2.0W @ 40°C 6.00°C/W @ 400 LFM 16.70°C/W Aluminum Black Anodized
V2031B

V2031B

HEATSINK CPU FORGED

Assmann WSW Components

1,202 -
V2031B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.492" (12.50mm) Thermal Tape, Adhesive (Not Included) - - 5.30°C/W Aluminum Alloy Black Anodized
DA-T268-301E-TR

DA-T268-301E-TR

HEATSINK FOR TO-268

Ohmite

1,311 -
DA-T268-301E-TR

数据表

D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.580" (40.13mm) - 0.460" (11.68mm) Solderable Feet 7.0W @ 35°C 4.00°C/W @ 700 LFM - Aluminum Black Anodized
ATS-CPX040040010-113-C2-R0

ATS-CPX040040010-113-C2-R0

HEATSINK 40X40X10MM XCUT CP

Advanced Thermal Solutions Inc.

2,550 -
ATS-CPX040040010-113-C2-R0

数据表

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) Push Pin - 11.79°C/W @ 100 LFM - Aluminum Blue Anodized
110990048

110990048

HEAT SINK KIT FOR RASPBERRY PI

Seeed Technology Co., Ltd

373 -
110990048

数据表

- Bulk Active Top Mount Kit Raspberry Pi Square, Fins - - - - Adhesive - - - Aluminum -
374324B60023G

374324B60023G

BGA HEAT SINK

Boyd Laconia, LLC

2,752 -
374324B60023G

数据表

37432 Bulk Active Board Level BGA, FPGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) Solder Anchor 1.5W @ 50°C 6.00°C/W @ 500 LFM 30.60°C/W Aluminum Black Anodized
HSE02-173213P

HSE02-173213P

HEAT SINK, EXTRUSION, 17 X 31.9

Same Sky (Formerly CUI Devices)

1,769 -
HSE02-173213P

数据表

HSE Box Active Top Mount - Square, Angled Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.492" (12.50mm) Thermal Tape, Adhesive (Included) 3.5W @ 75°C 6.70°C/W @ 200 LFM 21.44°C/W Aluminum Alloy Blue Anodized
ATS-CPX025025010-137-C1-R0

ATS-CPX025025010-137-C1-R0

HEATSINK 25X25X10MM L-TAB CP

Advanced Thermal Solutions Inc.

563 -
ATS-CPX025025010-137-C1-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) Push Pin - 18.29°C/W @ 100 LFM - Aluminum Blue Anodized
527-45AB

527-45AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette

1,670 -
527-45AB

数据表

527 Bulk Active Board Level Half Brick DC/DC Converter Rectangular, Fins 2.280" (57.91mm) 2.400" (60.96mm) - 0.950" (24.13mm) Bolt On, Thermal Material 7.0W @ 60°C 2.30°C/W @ 300 LFM - Aluminum Black Anodized
110991329

110991329

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

483 -
110991329

数据表

- Bulk Active Top Mount Kit Raspberry Pi 4B - - - - - Adhesive - - - Aluminum, Copper -
501503B00000G

501503B00000G

HEATSINK TO-3 1.00" BLK

Boyd Laconia, LLC

996 -
501503B00000G

数据表

- Bag Active Board Level TO-3 Rhombus 1.880" (47.75mm) 1.400" (35.56mm) - 1.000" (25.40mm) Bolt On 5.0W @ 40°C 2.00°C/W @ 500 LFM 8.40°C/W Aluminum Black Anodized
ATS-CPX025025015-166-C1-R0

ATS-CPX025025015-166-C1-R0

HEATSINK 25X25X15MM R-TAB CP

Advanced Thermal Solutions Inc.

5,577 -
ATS-CPX025025015-166-C1-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) Push Pin - 12.12°C/W @ 100 LFM - Aluminum Blue Anodized
530614B00000G

530614B00000G

HEATSINK TO-220 4.5W H=.5" BLK

Boyd Laconia, LLC

2,630 -
530614B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On 4.0W @ 80°C 6.00°C/W @ 600 LFM 16.70°C/W Aluminum Black Anodized
7-345-1PP-BA

7-345-1PP-BA

HEATSINK PWR HORZ BLACK TO-220

CTS Thermal Management Products

900 -
7-345-1PP-BA

数据表

7 Box Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 2.000" (50.80mm) - 0.553" (14.05mm) Bolt On 6.0W @ 50°C - 9.00°C/W Aluminum Black Anodized
WAVE-23-125

WAVE-23-125

ANCHOR HEATSINK 23X23X12.5MM

Wakefield-Vette

2,545 -
WAVE-23-125

数据表

Wave 2x Bulk Active Board Level BGA Square, Angled Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.492" (12.50mm) Clip - 6.76°C/W @ 200 LFM - Aluminum Alloy Black Anodized
ATS010010010-SF-1I

ATS010010010-SF-1I

HEATSINK 10X10X10MM

Advanced Thermal Solutions Inc.

166 -
ATS010010010-SF-1I

数据表

- Bulk Active Top Mount BGA Square, Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Not Included) - 31.20°C/W @ 200 LFM - Aluminum Black Anodized
501303B00000G

501303B00000G

HEAT SINK TO-3 .500" COMPACT

Boyd Laconia, LLC

346 -
501303B00000G

数据表

- Bag Active Board Level TO-3 Rhombus 1.880" (47.75mm) 1.400" (35.56mm) - 0.500" (12.70mm) Bolt On 2.0W @ 30°C 4.00°C/W @ 300 LFM 12.00°C/W Aluminum Black Anodized
TGH-0220-04

TGH-0220-04

ALUMINIUM HEAT SINK 22X22MM

t-Global Technology

898 -
TGH-0220-04

数据表

TGH Bulk Active Top Mount - Square, Pin Fins 0.866" (22.00mm) 0.866" (22.00mm) - 0.461" (11.70mm) - - - - Aluminum Black Anodized
TGH-0510-01

TGH-0510-01

ALUMINIUM HEAT SINK 51X35MM

t-Global Technology

589 -
TGH-0510-01

数据表

TGH Bulk Active Top Mount - Rectangular, Fins 1.378" (35.00mm) 2.008" (51.00mm) - 0.197" (5.00mm) - - - - Aluminum Black Anodized
219-263B-TR

219-263B-TR

TO-263 HEAT SINK ANODZD REEL

Wakefield-Vette

1,250 -
219-263B-TR

数据表

219 Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.386" (35.25mm) - 0.460" (11.68mm) Solderable Feet 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Black Anodized
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