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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-424-61-003000

116-43-424-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-424-61-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-324-61-003000

116-93-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-324-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-964-41-001000

614-93-964-41-001000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.

0 -
614-93-964-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-964-41-001000

614-43-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-964-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-652-61-105000

110-93-652-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-652-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-952-61-105000

110-93-952-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-952-61-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-529-21-121111

517-87-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip

0 -
517-87-529-21-121111

数据表

517 Bulk Active PGA 529 (21 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
111-43-432-61-001000

111-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-432-61-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-632-61-001000

111-43-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-632-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-432-61-001000

111-93-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-432-61-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-632-61-001000

111-93-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-632-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1018-G-R

APH-1018-G-R

APH-1018-G-R

Samtec Inc.

0 -
APH-1018-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0218-G-R

APH-0218-G-R

APH-0218-G-R

Samtec Inc.

0 -
APH-0218-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1618-G-R

APH-1618-G-R

APH-1618-G-R

Samtec Inc.

0 -
APH-1618-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1718-G-R

APH-1718-G-R

APH-1718-G-R

Samtec Inc.

0 -
APH-1718-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0318-G-R

APH-0318-G-R

APH-0318-G-R

Samtec Inc.

0 -
APH-0318-G-R

数据表

* - Active - - - - - - - - - - - - - - -
550-10-144-15-081101

550-10-144-15-081101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-144-15-081101

数据表

550 Bulk Active PGA 144 (15 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
550-10-144-12-000101

550-10-144-12-000101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-144-12-000101

数据表

550 Bulk Active PGA 144 (12 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
117-43-628-61-005000

117-43-628-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-43-628-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-93-628-61-005000

117-93-628-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-93-628-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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