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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-93-324-61-006000

116-93-324-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-324-61-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-324-G-H

APO-324-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-G-H

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
612-13-648-41-001000

612-13-648-41-001000

SOCKET CARRIER SLDRTL .600 48POS

Mill-Max Manufacturing Corp.

0 -
612-13-648-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-628-61-801000

110-43-628-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-628-61-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-628-61-801000

110-93-628-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-628-61-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-422-61-605000

110-93-422-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-422-61-605000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-424-61-001000

110-13-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-424-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
510-93-121-11-000001

510-93-121-11-000001

SOCKET SOLDERTAIL 121-PGA

Mill-Max Manufacturing Corp.

0 -
510-93-121-11-000001

数据表

510 Tube Active PGA 121 (11 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
117-43-448-61-005000

117-43-448-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-43-448-61-005000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-248-31-018000

714-43-248-31-018000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-248-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
32-6556-21

32-6556-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
32-6556-31

32-6556-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
36-3503-21

36-3503-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-3503-21

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
36-3503-31

36-3503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
546-83-192-14-001135

546-83-192-14-001135

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
546-83-192-14-001135

数据表

546 Bulk Active PGA 192 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-83-192-14-001136

546-83-192-14-001136

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
546-83-192-14-001136

数据表

546 Bulk Active PGA 192 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
126-93-652-41-003000

126-93-652-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-652-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-652-41-003000

126-43-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-652-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-328-61-105000

110-93-328-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-328-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-428-61-105000

110-93-428-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-428-61-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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