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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-43-640-61-001000

115-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-640-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-316-61-001000

116-43-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-316-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-316-61-001000

116-93-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-316-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-1111-TT-22-L

HLS-1111-TT-22-L

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-1111-TT-22-L

数据表

HLS Bulk Active SIP 121 (11 x 11) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
510-41-068-10-001001

510-41-068-10-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-068-10-001001

数据表

510 Bulk Active PGA 68 (10 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
550-10-145-15-001101

550-10-145-15-001101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-145-15-001101

数据表

550 Bulk Active PGA 145 (15 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
39-0511-11

39-0511-11

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
39-0511-11

数据表

511 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
40-1508-21

40-1508-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
40-1508-31

40-1508-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
32-C182-21

32-C182-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C182-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
32-C182-31

32-C182-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C182-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
32-C212-31

32-C212-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C212-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
32-C300-21

32-C300-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C300-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
32-C300-31

32-C300-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
612-13-650-41-001000

612-13-650-41-001000

SOCKET CARRIER SLDRTL .600 50POS

Mill-Max Manufacturing Corp.

0 -
612-13-650-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
42-3551-11

42-3551-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
42-3552-11

42-3552-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
42-6551-11

42-6551-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-6551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
42-6552-11

42-6552-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-6552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
510-41-069-11-061001

510-41-069-11-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-069-11-061001

数据表

510 Bulk Active PGA 69 (11 x 11) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
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