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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
123-91-964-41-001000

123-91-964-41-001000

SOCKET IC OPEN 3 LVL .900 64POS

Mill-Max Manufacturing Corp.

0 -
123-91-964-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-41-964-41-001000

123-41-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-41-964-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-650-41-001000

122-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-650-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
HLS-0407-G-18

HLS-0407-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0407-G-18

数据表

HLS Bulk Active SIP 28 (4 x 7) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
115-43-636-61-003000

115-43-636-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-636-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-952-41-001000

123-93-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-93-952-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-43-952-41-001000

123-43-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-43-952-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-168-17-101002

510-91-168-17-101002

SOCKET SOLDERTAIL 168-PGA

Mill-Max Manufacturing Corp.

0 -
510-91-168-17-101002

数据表

510 Tube Active PGA 168 (17 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
510-93-124-13-041001

510-93-124-13-041001

CONN SOCKET PGA 124POS GOLD

Mill-Max Manufacturing Corp.

0 -
510-93-124-13-041001

数据表

510 Tube Active PGA 124 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
510-41-168-17-101002

510-41-168-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-168-17-101002

数据表

510 Tube Active PGA 168 (17 x 17) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
116-43-640-61-003000

116-43-640-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-640-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-640-61-003000

116-93-640-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-640-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-422-G-B

APO-422-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-B

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-43-328-61-001000

116-43-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-328-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-628-61-001000

116-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-628-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-428-61-001000

116-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-428-61-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-628-61-001000

116-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-628-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-11-650-41-001000

123-11-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-650-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
510-41-064-10-051001

510-41-064-10-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-064-10-051001

数据表

510 Bulk Active PGA 64 (10 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
117-43-648-61-005000

117-43-648-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-43-648-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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