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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1124-G-T

APH-1124-G-T

APH-1124-G-T

Samtec Inc.

0 -
APH-1124-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1624-G-T

APH-1624-G-T

APH-1624-G-T

Samtec Inc.

0 -
APH-1624-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0724-G-T

APH-0724-G-T

APH-0724-G-T

Samtec Inc.

0 -
APH-0724-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1824-G-T

APH-1824-G-T

APH-1824-G-T

Samtec Inc.

0 -
APH-1824-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1324-G-T

APH-1324-G-T

APH-1324-G-T

Samtec Inc.

0 -
APH-1324-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0824-G-T

APH-0824-G-T

APH-0824-G-T

Samtec Inc.

0 -
APH-0824-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0224-G-T

APH-0224-G-T

APH-0224-G-T

Samtec Inc.

0 -
APH-0224-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1724-G-T

APH-1724-G-T

APH-1724-G-T

Samtec Inc.

0 -
APH-1724-G-T

数据表

* - Active - - - - - - - - - - - - - - -
323-93-164-41-001000

323-93-164-41-001000

SOCKET 3 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

0 -
323-93-164-41-001000

数据表

323 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-C300-31

28-C300-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
121-11-952-41-001000

121-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-952-41-001000

数据表

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
510-93-132-14-071001

510-93-132-14-071001

PGA SOCK 132PIN 14X14 SOLDER TL

Mill-Max Manufacturing Corp.

0 -
510-93-132-14-071001

数据表

510 Tube Active PGA 132 (14 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
40-C182-30

40-C182-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-C212-20

40-C212-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-C212-30

40-C212-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-C300-20

40-C300-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-C300-30

40-C300-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-43-316-61-008000

116-43-316-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-316-61-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-650-61-105000

110-93-650-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-650-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-950-61-105000

110-93-950-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-950-61-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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