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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
612-93-650-41-003000

612-93-650-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-650-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0320-G-22

HLS-0320-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0320-G-22

数据表

HLS Tube Active SIP 60 (3 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
223-PGM18039-10

223-PGM18039-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
223-PGM18039-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-93-950-41-008000

116-93-950-41-008000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-950-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-950-41-008000

116-43-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-950-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-642-41-001000

122-13-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-642-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
517-87-475-21-121111

517-87-475-21-121111

CONN SOCKET PGA 475POS GOLD

Preci-Dip

0 -
517-87-475-21-121111

数据表

517 Bulk Active PGA 475 (21 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-43-310-61-001000

116-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-310-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-950-61-001000

110-91-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-950-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-650-41-003000

126-41-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-650-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-650-41-003000

126-91-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-650-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
48-6823-90

48-6823-90

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
APH-1422-G-T

APH-1422-G-T

APH-1422-G-T

Samtec Inc.

0 -
APH-1422-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0922-G-T

APH-0922-G-T

APH-0922-G-T

Samtec Inc.

0 -
APH-0922-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1922-G-T

APH-1922-G-T

APH-1922-G-T

Samtec Inc.

0 -
APH-1922-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1122-G-T

APH-1122-G-T

APH-1122-G-T

Samtec Inc.

0 -
APH-1122-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0322-G-T

APH-0322-G-T

APH-0322-G-T

Samtec Inc.

0 -
APH-0322-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1322-G-T

APH-1322-G-T

APH-1322-G-T

Samtec Inc.

0 -
APH-1322-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0722-G-T

APH-0722-G-T

APH-0722-G-T

Samtec Inc.

0 -
APH-0722-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0222-G-T

APH-0222-G-T

APH-0222-G-T

Samtec Inc.

0 -
APH-0222-G-T

数据表

* - Active - - - - - - - - - - - - - - -
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