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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1220-G-R

APH-1220-G-R

APH-1220-G-R

Samtec Inc.

0 -
APH-1220-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1720-G-R

APH-1720-G-R

APH-1720-G-R

Samtec Inc.

0 -
APH-1720-G-R

数据表

* - Active - - - - - - - - - - - - - - -
ICA-648-ZHGT

ICA-648-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZHGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
116-43-308-61-008000

116-43-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-308-61-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-652-41-780000

104-13-652-41-780000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-652-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
ICA-640-ZWGG-2

ICA-640-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZWGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
614-41-964-31-012000

614-41-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-964-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-964-31-012000

614-91-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-964-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-314-61-605000

110-43-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-314-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-314-61-605000

110-93-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-314-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-632-61-105000

110-43-632-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-632-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-632-61-105000

110-93-632-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-632-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-420-61-003000

115-44-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-420-61-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-80-191-18-091101

550-80-191-18-091101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-191-18-091101

数据表

550 Bulk Active PGA 191 (18 x 18) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-93-650-41-001000

612-93-650-41-001000

SOCKET CARRIER SLDRTL .600 50POS

Mill-Max Manufacturing Corp.

0 -
612-93-650-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-650-41-001000

612-43-650-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-650-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-47-950-41-001000

123-47-950-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
123-47-950-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-10-124-13-041101

550-10-124-13-041101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-124-13-041101

数据表

550 Bulk Active PGA 124 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
614-87-181-15-051112

614-87-181-15-051112

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
614-87-181-15-051112

数据表

614 Bulk Active PGA 181 (15 x 15) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0411-G-2

HLS-0411-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0411-G-2

数据表

HLS Bulk Active SIP 44 (4 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
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