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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
38-0501-21

38-0501-21

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0501-21

数据表

501 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
38-0501-31

38-0501-31

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0501-31

数据表

501 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
115-93-636-61-001000

115-93-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-636-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-93-950-41-001000

126-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-950-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-950-41-001000

126-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-950-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-652-41-004000

612-41-652-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-652-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-652-41-004000

612-91-652-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-652-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1940-T-H

APH-1940-T-H

APH-1940-T-H

Samtec Inc.

0 -
APH-1940-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1140-T-H

APH-1140-T-H

APH-1140-T-H

Samtec Inc.

0 -
APH-1140-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0240-T-H

APH-0240-T-H

APH-0240-T-H

Samtec Inc.

0 -
APH-0240-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0640-T-H

APH-0640-T-H

APH-0640-T-H

Samtec Inc.

0 -
APH-0640-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1240-T-H

APH-1240-T-H

APH-1240-T-H

Samtec Inc.

0 -
APH-1240-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0340-T-H

APH-0340-T-H

APH-0340-T-H

Samtec Inc.

0 -
APH-0340-T-H

数据表

* - Active - - - - - - - - - - - - - - -
116-93-964-41-003000

116-93-964-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-964-41-003000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-964-41-003000

116-43-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-964-41-003000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-324-61-007000

116-43-324-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-324-61-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-624-61-007000

116-43-624-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-624-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-624-61-007000

116-93-624-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-624-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-640-61-003000

115-93-640-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-640-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-325-18-111111

517-83-325-18-111111

CONN SOCKET PGA 325POS GOLD

Preci-Dip

0 -
517-83-325-18-111111

数据表

517 Bulk Active PGA 325 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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