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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0822-G-T

APH-0822-G-T

APH-0822-G-T

Samtec Inc.

0 -
APH-0822-G-T

数据表

* - Active - - - - - - - - - - - - - - -
1051420433

1051420433

CONN SOCKET LGA 2011POS GOLD

Molex

0 -
1051420433

数据表

105142 Bulk Obsolete LGA 2011 (47 x 58) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.040" (1.02mm) Solder 0.040" (1.01mm) - - Thermoplastic - -
28-6508-211

28-6508-211

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-211

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-6508-311

28-6508-311

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-311

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-43-432-61-105000

110-43-432-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-432-61-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-308-61-105000

110-43-308-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-308-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-316-61-605000

110-43-316-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-316-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-316-61-605000

110-93-316-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-316-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-93-085-11-041001

510-93-085-11-041001

CONN SOCKET PGA 85POS GOLD

Mill-Max Manufacturing Corp.

0 -
510-93-085-11-041001

数据表

510 Tube Active PGA 85 (11 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APH-1816-G-R

APH-1816-G-R

APH-1816-G-R

Samtec Inc.

0 -
APH-1816-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0616-G-R

APH-0616-G-R

APH-0616-G-R

Samtec Inc.

0 -
APH-0616-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0216-G-R

APH-0216-G-R

APH-0216-G-R

Samtec Inc.

0 -
APH-0216-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0816-G-R

APH-0816-G-R

APH-0816-G-R

Samtec Inc.

0 -
APH-0816-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1316-G-R

APH-1316-G-R

APH-1316-G-R

Samtec Inc.

0 -
APH-1316-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0716-G-R

APH-0716-G-R

APH-0716-G-R

Samtec Inc.

0 -
APH-0716-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0316-G-R

APH-0316-G-R

APH-0316-G-R

Samtec Inc.

0 -
APH-0316-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1216-G-R

APH-1216-G-R

APH-1216-G-R

Samtec Inc.

0 -
APH-1216-G-R

数据表

* - Active - - - - - - - - - - - - - - -
123-11-642-41-001000

123-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-642-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APO-628-G-H

APO-628-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-G-H

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
126-93-650-41-002000

126-93-650-41-002000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-650-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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