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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
714-93-132-31-007000

714-93-132-31-007000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

0 -
714-93-132-31-007000

数据表

714 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-636-41-001000

110-13-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-636-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
ICO-322-BGG

ICO-322-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-BGG

数据表

ICO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
116-47-432-41-001000

116-47-432-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-432-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-632-41-001000

116-47-632-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-632-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
23-0503-31

23-0503-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0503-31

数据表

0503 Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
111-41-952-41-001000

111-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-952-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-952-41-001000

111-91-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-952-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
21-0511-11

21-0511-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0511-11

数据表

511 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
115-41-950-41-001000

115-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-950-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-950-41-001000

115-91-950-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-950-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
316-93-132-41-003000

316-93-132-41-003000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

0 -
316-93-132-41-003000

数据表

316 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0414-T-22

HLS-0414-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0414-T-22

数据表

HLS Bulk Active SIP 56 (4 x 14) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
HLS-0708-T-22

HLS-0708-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0708-T-22

数据表

HLS Bulk Active SIP 56 (7 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
APH-1836-T-R

APH-1836-T-R

APH-1836-T-R

Samtec Inc.

0 -
APH-1836-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1436-T-R

APH-1436-T-R

APH-1436-T-R

Samtec Inc.

0 -
APH-1436-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0536-T-R

APH-0536-T-R

APH-0536-T-R

Samtec Inc.

0 -
APH-0536-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1036-T-R

APH-1036-T-R

APH-1036-T-R

Samtec Inc.

0 -
APH-1036-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1536-T-R

APH-1536-T-R

APH-1536-T-R

Samtec Inc.

0 -
APH-1536-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0736-T-R

APH-0736-T-R

APH-0736-T-R

Samtec Inc.

0 -
APH-0736-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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