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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
126-41-328-41-002000

126-41-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-328-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-428-41-002000

126-41-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-428-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-628-41-002000

126-41-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-628-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-328-41-002000

126-91-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-328-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-428-41-002000

126-91-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-428-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-628-41-002000

126-91-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-628-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
322-13-120-41-001000

322-13-120-41-001000

SOCKET 2 LEVEL WRAPOST SIP 20POS

Mill-Max Manufacturing Corp.

0 -
322-13-120-41-001000

数据表

322 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
44-6554-10

44-6554-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-6554-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
122-11-324-41-001000

122-11-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-324-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-424-41-001000

122-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-424-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-624-41-001000

122-11-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-624-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
546-87-169-17-101135

546-87-169-17-101135

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
546-87-169-17-101135

数据表

546 Bulk Active PGA 169 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-87-169-17-101136

546-87-169-17-101136

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
546-87-169-17-101136

数据表

546 Bulk Active PGA 169 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
114-93-648-41-117000

114-93-648-41-117000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-648-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-43-648-41-117000

114-43-648-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-648-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-308-61-001000

110-13-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-308-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-41-308-61-001000

110-41-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-308-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-308-61-001000

110-93-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-308-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-308-61-001000

110-99-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-308-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-308-61-001000

115-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-308-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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