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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1626-T-H

APH-1626-T-H

APH-1626-T-H

Samtec Inc.

0 -
APH-1626-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1226-T-H

APH-1226-T-H

APH-1226-T-H

Samtec Inc.

0 -
APH-1226-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1726-T-H

APH-1726-T-H

APH-1726-T-H

Samtec Inc.

0 -
APH-1726-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0826-T-H

APH-0826-T-H

APH-0826-T-H

Samtec Inc.

0 -
APH-0826-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0326-T-H

APH-0326-T-H

APH-0326-T-H

Samtec Inc.

0 -
APH-0326-T-H

数据表

* - Active - - - - - - - - - - - - - - -
126-93-320-41-003000

126-93-320-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-320-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-93-420-41-003000

126-93-420-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-420-41-003000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-320-41-003000

126-43-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-320-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-420-41-003000

126-43-420-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-420-41-003000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-328-41-780000

104-11-328-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-328-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
104-11-428-41-780000

104-11-428-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-428-41-780000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
104-11-628-41-780000

104-11-628-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-628-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-21

数据表

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-31

数据表

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-211

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-311

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-47-652-41-006000

116-47-652-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-652-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0610-T-2

HLS-0610-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0610-T-2

数据表

HLS Bulk Active SIP 60 (6 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
APH-1814-G-R

APH-1814-G-R

APH-1814-G-R

Samtec Inc.

0 -
APH-1814-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0514-G-R

APH-0514-G-R

APH-0514-G-R

Samtec Inc.

0 -
APH-0514-G-R

数据表

* - Active - - - - - - - - - - - - - - -
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