富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
124-93-320-41-002000

124-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
124-93-320-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-93-420-41-002000

124-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
124-93-420-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-43-320-41-002000

124-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-43-320-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-43-420-41-002000

124-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-43-420-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-47-950-41-001000

111-47-950-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
111-47-950-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-964-41-105000

110-47-964-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-964-41-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
30-81250-610C

30-81250-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
30-8563-610C

30-8563-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-8563-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
30-8940-310C

30-8940-310C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-8940-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
30-8950-610C

30-8950-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-8950-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
321-13-120-41-001000

321-13-120-41-001000

SOCKET 1 LEVEL WRAPOST SIP 20POS

Mill-Max Manufacturing Corp.

0 -
321-13-120-41-001000

数据表

321 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APH-1834-T-R

APH-1834-T-R

APH-1834-T-R

Samtec Inc.

0 -
APH-1834-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1934-T-R

APH-1934-T-R

APH-1934-T-R

Samtec Inc.

0 -
APH-1934-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0234-T-R

APH-0234-T-R

APH-0234-T-R

Samtec Inc.

0 -
APH-0234-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1634-T-R

APH-1634-T-R

APH-1634-T-R

Samtec Inc.

0 -
APH-1634-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0434-T-R

APH-0434-T-R

APH-0434-T-R

Samtec Inc.

0 -
APH-0434-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0334-T-R

APH-0334-T-R

APH-0334-T-R

Samtec Inc.

0 -
APH-0334-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1234-T-R

APH-1234-T-R

APH-1234-T-R

Samtec Inc.

0 -
APH-1234-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0634-T-R

APH-0634-T-R

APH-0634-T-R

Samtec Inc.

0 -
APH-0634-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0734-T-R

APH-0734-T-R

APH-0734-T-R

Samtec Inc.

0 -
APH-0734-T-R

数据表

* - Active - - - - - - - - - - - - - - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户