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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1924-T-R

APH-1924-T-R

APH-1924-T-R

Samtec Inc.

0 -
APH-1924-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1024-T-R

APH-1024-T-R

APH-1024-T-R

Samtec Inc.

0 -
APH-1024-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1124-T-R

APH-1124-T-R

APH-1124-T-R

Samtec Inc.

0 -
APH-1124-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1724-T-R

APH-1724-T-R

APH-1724-T-R

Samtec Inc.

0 -
APH-1724-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1224-T-R

APH-1224-T-R

APH-1224-T-R

Samtec Inc.

0 -
APH-1224-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0224-T-R

APH-0224-T-R

APH-0224-T-R

Samtec Inc.

0 -
APH-0224-T-R

数据表

* - Active - - - - - - - - - - - - - - -
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

0 -
614-87-124-13-041112

数据表

614 Bulk Active PGA 124 (13 x 13) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-21

数据表

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-31

数据表

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
126-41-318-41-003000

126-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-318-41-003000

126-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-321-17-101111

517-87-321-17-101111

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
517-87-321-17-101111

数据表

517 Bulk Active PGA 321 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-328-41-003000

116-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-328-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-428-41-003000

116-93-428-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-428-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-628-41-003000

116-93-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-628-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-328-41-003000

116-43-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-328-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-428-41-003000

116-43-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-428-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
38-6820-90C

38-6820-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
38-6822-90C

38-6822-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
38-6823-90C

38-6823-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-6823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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