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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
26-822-90C

26-822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
510-83-257-20-111101

510-83-257-20-111101

CONN SOCKET PGA 257POS GOLD

Preci-Dip

0 -
510-83-257-20-111101

数据表

510 Bulk Active PGA 257 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-47-428-41-005000

117-47-428-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-428-41-005000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-13-310-41-001000

123-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-310-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-41-316-31-018000

614-41-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-316-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-316-31-018000

614-91-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-316-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-650-41-001000

110-91-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-91-650-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-650-41-001000

110-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-650-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0217-G-10

HLS-0217-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0217-G-10

数据表

HLS Tube Active SIP 34 (2 x 17) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0214-G-12

HLS-0214-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0214-G-12

数据表

HLS Tube Active SIP 28 (2 x 14) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APO-632-T-A1

APO-632-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-632-T-A1

数据表

* - Active - - - - - - - - - - - - - - -
8060-1G6

8060-1G6

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
8060-1G6

数据表

8060 Bulk Obsolete Transistor, TO-5 4 (Round) Gold - Beryllium Copper Panel Mount Closed Frame - Solder - -55°C ~ 125°C Gold Fluoropolymer (FP) - Beryllium Copper
317-93-118-41-005000

317-93-118-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-118-41-005000

数据表

317 Bulk Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-320-41-770000

104-11-320-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-320-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
104-11-420-41-770000

104-11-420-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-420-41-770000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
ICO-640-ZCGT

ICO-640-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-ZCGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
104-11-318-41-770000

104-11-318-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-318-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
111-41-636-41-001000

111-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-636-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-636-41-001000

111-91-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-636-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-6518-01

40-6518-01

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-01

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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