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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
612-11-310-41-001000

612-11-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-310-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
110-11-322-41-001000

110-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-322-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-11-422-41-001000

110-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-422-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-306-41-001000

122-13-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-306-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
30-9503-20

30-9503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-9503-20

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
30-9503-30

30-9503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-9503-30

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
32-822-90C

32-822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-823-90C

32-823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0412-T-2

HLS-0412-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0412-T-2

数据表

HLS Bulk Active SIP 48 (4 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-93-314-41-007000

116-93-314-41-007000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-314-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-314-41-007000

116-43-314-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-314-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
25-0501-21

25-0501-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0501-21

数据表

501 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
25-0501-31

25-0501-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0501-31

数据表

501 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
ICA-628-ZWGG-2

ICA-628-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZWGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
510-83-261-18-071101

510-83-261-18-071101

CONN SOCKET PGA 261POS GOLD

Preci-Dip

0 -
510-83-261-18-071101

数据表

510 Bulk Active PGA 261 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
346-93-154-41-013000

346-93-154-41-013000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-154-41-013000

数据表

346 Bulk Active SIP 54 (1 x 54) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-154-41-013000

346-43-154-41-013000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-154-41-013000

数据表

346 Bulk Active SIP 54 (1 x 54) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-324-ZHGT

ICA-324-ZHGT

CONN IC DIP SOCKET 24POS GOLD

Samtec Inc.

0 -
ICA-324-ZHGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
111-41-432-41-001000

111-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-432-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-632-41-001000

111-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-632-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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