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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1826-T-R

APH-1826-T-R

APH-1826-T-R

Samtec Inc.

0 -
APH-1826-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1328-T-T

APH-1328-T-T

APH-1328-T-T

Samtec Inc.

0 -
APH-1328-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1726-T-R

APH-1726-T-R

APH-1726-T-R

Samtec Inc.

0 -
APH-1726-T-R

数据表

* - Active - - - - - - - - - - - - - - -
121-13-210-41-001000

121-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-210-41-001000

数据表

121 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
317-91-119-41-005000

317-91-119-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-119-41-005000

数据表

317 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-642-41-001000

110-91-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-91-642-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-642-41-001000

110-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-642-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-3575-10

28-3575-10

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

0 -
28-3575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
28-6575-10

28-6575-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0 -
28-6575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
117-47-628-41-005000

117-47-628-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-628-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0508-20

数据表

508 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0508-30

数据表

508 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
115-47-642-41-001000

115-47-642-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-642-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-424-41-001000

111-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
111-93-424-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-424-41-001000

111-43-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-424-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-640-41-003000

115-44-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-640-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-640-41-605000

110-47-640-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-640-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-632-MGG

ICO-632-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-MGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
115-47-636-41-003000

115-47-636-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-636-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0307-G-18

HLS-0307-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0307-G-18

数据表

HLS Tube Active SIP 21 (3 x 7) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
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