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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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114-47-632-41-117000STANDRD SOLDRTL DBL SKT |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
115-44-428-41-003000CONN IC SKT DBL |
0 | - |
|
数据表 |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
111-93-322-41-001000CONN IC DIP SOCKET 22POS GOLD |
0 | - |
|
数据表 |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
111-93-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
0 | - |
|
数据表 |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
111-43-322-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
111-43-422-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
APO-632-G-A1.100" LOW PROFILE SCREW MACHINE |
0 | - |
|
数据表 |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
614-41-314-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-91-314-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
ICA-324-WGG.100" SCREW MACHINE DIP SOCKET |
0 | - |
|
数据表 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
110-93-422-41-105000CONN IC DIP SOCKET 22POS GOLD |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-43-322-41-105000CONN IC SKT DBL |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-43-422-41-105000CONN IC SKT DBL |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-43-308-41-004000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-93-308-41-004000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-91-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-11-308-41-001000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
104-13-210-41-780000CONN IC DIP SOCKET 10POS GOLD |
0 | - |
|
数据表 |
104 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | Gold | Thermoplastic | 10.0µin (0.25µm) | Brass Alloy |
|
614-41-314-31-002000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-91-314-31-002000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
