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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
346-93-153-41-013000

346-93-153-41-013000

CONN SOCKET SIP 53POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-153-41-013000

数据表

346 Bulk Active SIP 53 (1 x 53) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-153-41-013000

346-43-153-41-013000

CONN SOCKET SIP 53POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-153-41-013000

数据表

346 Bulk Active SIP 53 (1 x 53) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
39-0508-20

39-0508-20

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
39-0508-20

数据表

508 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
39-0508-30

39-0508-30

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
39-0508-30

数据表

508 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
116-93-210-41-001000

116-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-210-41-001000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-322-41-006000

116-41-322-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-322-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-422-41-006000

116-41-422-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-422-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-322-41-006000

116-91-322-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-322-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-422-41-006000

116-91-422-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-422-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-648-SGG

ICA-648-SGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-SGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
115-44-636-41-003000

115-44-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-636-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
30-9513-11H

30-9513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-9513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
410-91-214-10-001000

410-91-214-10-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
410-91-214-10-001000

数据表

410 Tube Active Zig-Zag, Left Stackable 14 (2 x 7) - - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
104-11-314-41-770000

104-11-314-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-314-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-93-422-41-801000

110-93-422-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-422-41-801000

数据表

110 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-6570-10

28-6570-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0 -
28-6570-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
115-91-632-41-003000

115-91-632-41-003000

SOCKET IC OPEN LOWPRO .600 32POS

Mill-Max Manufacturing Corp.

0 -
115-91-632-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 200.0µin (5.08µm) Brass Alloy
115-41-632-41-003000

115-41-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-632-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8-1437504-5

8-1437504-5

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0 -
8-1437504-5

数据表

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) Tin - Beryllium Copper Chassis Mount Closed Frame - Solder - -55°C ~ 125°C Tin Polytetrafluoroethylene (PTFE) - Beryllium Copper
114-47-432-41-117000

114-47-432-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-432-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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