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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-99-428-41-001000

110-99-428-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-428-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-93-105-41-005000

317-93-105-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-105-41-005000

数据表

317 Tube Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-652-41-013101

116-87-652-41-013101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-4508-30

20-4508-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4508-30

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APO-316-G-C

APO-316-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-316-G-C

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
0479890112

0479890112

CONN SOCKET PGA 989POS GOLD

Molex

0 -
0479890112

数据表

47989 Tray Obsolete PGA 989 (35 x 36) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.039" (1.00mm) - - Liquid Crystal Polymer (LCP) - -
APA-314-G-P

APA-314-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-314-G-P

数据表

APA Tube Active - 14 (2 x 7) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
115-41-318-41-001000

115-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-318-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-318-41-001000

115-91-318-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-318-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-306-41-002000

126-41-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-306-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-306-41-002000

126-91-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-306-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-1508-21

18-1508-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
18-1508-31

18-1508-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
614-93-306-41-001000

614-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-306-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-306-41-001000

614-43-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-306-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0210-G-12

HLS-0210-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0210-G-12

数据表

HLS Tube Active SIP 20 (2 x 10) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
210-44-628-41-001000

210-44-628-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-628-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-648-T-M

APA-648-T-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-T-M

数据表

APA Tube Active - 48 (2 x 24) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APH-0618-T-H

APH-0618-T-H

APH-0618-T-H

Samtec Inc.

0 -
APH-0618-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1318-T-H

APH-1318-T-H

APH-1318-T-H

Samtec Inc.

0 -
APH-1318-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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