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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
18-0501-31

18-0501-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0501-31

数据表

501 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
714-43-136-31-018000

714-43-136-31-018000

CONN SOCKET SIP 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-136-31-018000

数据表

714 Bulk Active SIP 36 (1 x 36) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
146-93-308-41-012000

146-93-308-41-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-308-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-210-41-007000

116-47-210-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-210-41-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-47-318-41-001000

111-47-318-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
111-47-318-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-6503-20

32-6503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
32-6503-30

32-6503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
32-PGM07002-10

32-PGM07002-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
32-PGM07002-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
317-47-111-41-005000

317-47-111-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-111-41-005000

数据表

317 Bulk Active SIP 11 (1 x 11) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-91-110-41-005000

317-91-110-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-110-41-005000

数据表

317 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-322-WGG-3

ICA-322-WGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-WGG-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
116-83-648-41-004101

116-83-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-83-648-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
514-87-120-13-061117

514-87-120-13-061117

CONN SOCKET PGA 120POS GOLD

Preci-Dip

0 -
514-87-120-13-061117

数据表

514 Bulk Active PGA 120 (13 x 13) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-41-308-41-007000

116-41-308-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-308-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-308-41-007000

116-91-308-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-308-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-43-107-41-005000

317-43-107-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-107-41-005000

数据表

317 Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
23-0503-20

23-0503-20

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0503-20

数据表

0503 Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
23-0503-30

23-0503-30

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0503-30

数据表

0503 Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
116-93-308-41-006000

116-93-308-41-006000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-308-41-006000

116-43-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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