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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR 42-HZL/01-TT

AR 42-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
AR 42-HZL/01-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
116-87-316-41-008101

116-87-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
28-6518-10T

28-6518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-10T

数据表

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
5-1437529-9

5-1437529-9

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors

0 -
5-1437529-9

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Polyester - Beryllium Copper
SIP050-1X25-157B

SIP050-1X25-157B

1X25-157B-SIP SOCKET 25 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X25-157B

数据表

SIP050-1x Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
122-87-318-41-001101

122-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
122-87-318-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-87-318-41-001101

123-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
123-87-318-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0103-G-12

HLS-0103-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-G-12

数据表

HLS Tube Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
612-87-624-41-001101

612-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
612-87-624-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-314-41-001101

116-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-0518-11H

08-0518-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0518-11H

数据表

518 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
08-1518-11H

08-1518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
14-1518-11

14-1518-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
17-0518-10H

17-0518-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0518-10H

数据表

518 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-83-318-41-105101

110-83-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 22-HZL/07-TT

AR 22-HZL/07-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL/07-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
ICO-308-STT-L

ICO-308-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-STT-L

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
116-83-310-41-011101

116-83-310-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-322-41-003101

116-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-83-314-41-001101

122-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
122-83-314-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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