| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S912XET512BMAGIC MCU 16BIT 512KB FLASH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | HCS12X | Tray | Active | Not Verified | HCS12X | 50MHz | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | - | 119 | 512KB (512K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 125°C (TA) | 32K x 8 | - | External | 1.72V ~ 5.5V | A/D 24x12b | Surface Mount | |
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S912XET512J3MAGIC MCU 16BIT 512KB FLASH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | HCS12X | Tray | Active | Not Verified | HCS12X | 50MHz | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | - | 119 | 512KB (512K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 125°C (TA) | 32K x 8 | - | External | 1.72V ~ 5.5V | A/D 24x12b | Surface Mount | |
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S32K324EHT1MPBITS32K324EHT1MPBIT NXP USA Inc. |
0 | - |
|
数据表 |
172-QFP | S32K3 | Bulk | Active | - | ARM® Cortex®-M7 | 160MHz | CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART | DMA, I2S, WDT | Automotive | 142 | 4MB (4M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 125°C (TA) | 512K x 8 | AEC-Q100 | External, Internal | 2.97V ~ 5.5V | A/D 24x12b SAR | Surface Mount | |
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MCF52233CVM60IC MCU 32B 256KB FLASH 121MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
121-LBGA | MCF5223x | Tray | Active | Not Verified | Coldfire V2 | 60MHz | Ethernet, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | - | 73 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 3V ~ 3.6V | A/D 8x12b | Surface Mount | |
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S912XDG256F1MAAIC MCU 16BIT 256KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12X | Tray | Last Time Buy | Not Verified | HCS12X | 80MHz | CANbus, I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 59 | 256KB (256K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 125°C (TA) | 14K x 8 | - | External | 2.35V ~ 5.5V | A/D 8x10b, 16x10b | Surface Mount | |
|
SP5746BK1AMKU2RIC MCU 32BIT 3MB FLASH 176LQFP NXP USA Inc. |
0 | - |
|
数据表 |
176-LQFP Exposed Pad | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z4 | 120MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | 129 | 3MB (3M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 125°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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SPC5746BK1MKU2RIC MCU 32BIT 3MB FLASH 176LQFP NXP USA Inc. |
0 | - |
|
数据表 |
176-LQFP Exposed Pad | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z4 | 120MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | 129 | 3MB (3M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 125°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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S908AB32AH3CFUEIC MCU 8BIT 32KB FLASH 64QFP NXP USA Inc. |
0 | - |
|
数据表 |
64-QFP | HC08 | Bulk | Not For New Designs | Not Verified | HC08 | 8MHz | SCI, SPI | POR, PWM | - | 51 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8b | Surface Mount | |
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S908AB32AE2CFUEIC MCU 8BIT 32KB FLASH 64QFP NXP USA Inc. |
0 | - |
|
数据表 |
64-QFP | HC08 | Bulk | Not For New Designs | Not Verified | HC08 | 8MHz | SCI, SPI | POR, PWM | - | 51 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8b | Surface Mount | |
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LPC845M301JHI33EIC MCU 32BIT 64KB FLASH 32HVQFN NXP USA Inc. |
0 | - |
|
数据表 |
32-VFQFN Exposed Pad | LPC84x | Tray | Discontinued at Digi-Key | Not Verified | ARM® Cortex®-M0+ | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 29 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | External, Internal | 1.8V ~ 3.6V | A/D 12x12b; D/A 1x10b | Surface Mount |