| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SP5745BBK1AMMH6RIC MCU 32BIT 2MB FLASH 100MAPBGA NXP USA Inc. |
0 | - |
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数据表 |
100-LFBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z4 | 160MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | - | 2MB (2M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 125°C (TA) | 256K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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SPC5746BTK1AVMH6IC MCU 32BIT 3MB FLASH 100MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
100-LFBGA | MPC57xx | Tray | Active | Not Verified | e200z4 | 160MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | - | 3MB (3M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 105°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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S9S12D64F0VFUEIC MCU 16BIT 64KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12 | Tray | Last Time Buy | Not Verified | HCS12 | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | - | 59 | 64KB (64K x 8) | 16-Bit | FLASH | 1K x 8 | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 2.35V ~ 5.25V | A/D 16x10b | Surface Mount | |
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S912XDG256F1MAARIC MCU 16BIT 256KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12X | Tape & Reel (TR) | Last Time Buy | Not Verified | HCS12X | 80MHz | CANbus, I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 59 | 256KB (256K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 125°C (TA) | 14K x 8 | - | External | 2.35V ~ 5.5V | A/D 8x10b, 16x10b | Surface Mount | |
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SP5746BTK1AVMH6RIC MCU 32BIT 3MB FLASH 100MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
100-LFBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z4 | 160MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | - | 3MB (3M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 105°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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MC68331CFC16B1IC MCU 32BIT ROMLESS 132PQFP NXP USA Inc. |
0 | - |
|
数据表 |
132-BQFP Bumpered | M683xx | Tray | Obsolete | Not Verified | CPU32 | 16MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | - | 18 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | - | - | Internal | 4.5V ~ 5.5V | - | Surface Mount | |
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MC908AB32CFUERIC MCU 8BIT 32KB FLASH 64QFP NXP USA Inc. |
0 | - |
|
数据表 |
64-QFP | HC08 | Tape & Reel (TR) | Not For New Designs | Not Verified | HC08 | 8MHz | SCI, SPI | POR, PWM | - | 51 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8b | Surface Mount | |
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S908AB32AH3CFUERIC MCU 8BIT 32KB FLASH 64QFP NXP USA Inc. |
0 | - |
|
数据表 |
64-QFP | HC08 | Tape & Reel (TR) | Not For New Designs | Not Verified | HC08 | 8MHz | SCI, SPI | POR, PWM | - | 51 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8b | Surface Mount | |
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MC9S12E256CPVEIC MCU 16BIT 256KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12 | Tray | Obsolete | Not Verified | HCS12 | 25MHz | EBI/EMI, I2C, SCI, SPI | POR, PWM, WDT | - | 91 | 256KB (256K x 8) | 16-Bit | FLASH | - | -40°C ~ 85°C (TA) | 16K x 8 | - | Internal | 2.35V ~ 2.75V | A/D 16x10b; D/A 2x8b | Surface Mount | |
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LPC2926FBD144,551IC MCU 16/32B 256KB FLSH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | LPC2900 | Tray | Obsolete | Not Verified | ARM9® | 125MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB | DMA, POR, PWM, WDT | - | 104 | 256KB (256K x 8) | 16/32-Bit | FLASH | 16K x 8 | -40°C ~ 85°C (TA) | 56K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 24x10b | Surface Mount |