| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S12C128VFUEIC MCU 16BIT 128KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12 | Tray | Active | Not Verified | HCS12 | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | - | 60 | 128KB (128K x 8) | 16-Bit | FLASH | - | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 2.35V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
MCF54416CMJ250IC MCU 32BIT ROMLESS 256MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MCF5441x | Tray | Active | Not Verified | Coldfire V4 | 250MHz | 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | DMA, PWM, WDT | - | 87 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 64K x 8 | - | Internal | 1.14V ~ 1.32V | A/D 8x12b; D/A 2x12b | Surface Mount | |
|
SPC5607BK0CLU4IC MCU 32BIT 1.5MB FLASH 176LQFP NXP USA Inc. |
0 | - |
|
数据表 |
176-LQFP | MPC56xx Qorivva | Tray | Active | Not Verified | e200z0h | 64MHz | CANbus, I2C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | - | 149 | 1.5MB (1.5M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 85°C (TA) | 96K x 8 | - | Internal | 3V ~ 5.5V | A/D 29x10b, 5x12b | Surface Mount | |
|
SPC5607BK0CLU4RIC MCU 32BIT 1.5MB FLASH 176LQFP NXP USA Inc. |
0 | - |
|
数据表 |
176-LQFP | MPC56xx Qorivva | Tape & Reel (TR) | Active | Not Verified | e200z0h | 64MHz | CANbus, I2C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | - | 149 | 1.5MB (1.5M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 85°C (TA) | 96K x 8 | - | Internal | 3V ~ 5.5V | A/D 29x10b, 5x12b | Surface Mount | |
|
MC9S12DG256BCPVIC MCU 16BIT 256KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12 | Tray | Obsolete | Not Verified | HCS12 | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | - | 91 | 256KB (256K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 12K x 8 | - | Internal | 2.35V ~ 5.25V | A/D 16x10b | Surface Mount | |
|
SPC5744PEK1AMMM5IC MCU 32B 2.5MB FLASH 257MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
257-LFBGA | MPC57xx | Tray | Active | Not Verified | e200z4 | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | - | - | 2.5MB (2.5M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 64x12b | Surface Mount | |
|
MC9S12XEQ512CALRIC MCU 16BIT 512KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12X | Tape & Reel (TR) | Active | Not Verified | HCS12X | 50MHz | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | - | 91 | 512KB (512K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 32K x 8 | - | External | 1.72V ~ 5.5V | A/D 16x12b | Surface Mount | |
|
MC9S12XEQ384MALIC MCU 16BIT 384KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12X | Tray | Active | Not Verified | HCS12X | 50MHz | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | - | 91 | 384KB (384K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 125°C (TA) | 24K x 8 | - | External | 1.72V ~ 5.5V | A/D 16x12b | Surface Mount | |
|
S32K324EHT1MMMSRS32K324EHT1MMMSR NXP USA Inc. |
0 | - |
|
数据表 |
257-LFBGA | S32K3 | Tape & Reel (TR) | Active | - | ARM® Cortex®-M7 | 160MHz | CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART | DMA, I2S, WDT | Automotive | 218 | 4MB (4M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 125°C (TA) | 512K x 8 | AEC-Q100 | External, Internal | 2.97V ~ 5.5V | A/D 24x12b SAR | Surface Mount | |
|
|
MC68HC11K1CFN4IC MCU 8BIT ROMLESS 84PLCC NXP USA Inc. |
0 | - |
|
数据表 |
84-LCC (J-Lead) | HC11 | Tube | Obsolete | Not Verified | HC11 | 4MHz | SCI, SPI | POR, PWM, WDT | - | 37 | - | 8-Bit | ROMless | 640 x 8 | -40°C ~ 85°C (TA) | 768 x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8b | Surface Mount |