| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
579103V00000GSTD,579103V00000G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | TO-3 | Rectangular | 1.125" (28.58mm) | 1.540" (39.12mm) | - | 0.870" (22.10mm) | Bolt On | 1.5W @ 30°C | 6.00°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
520327B00000GSTD,520327B00000G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-3 | Rectangular | 1.534" (38.96mm) | 1.250" (31.75mm) | - | 0.500" (12.70mm) | Bolt On | 3W @ 40°C | 3.00°C/W @ 600 LFM | 4.70°C/W | Aluminum | Black Anodized |
|
780301F00000GEXTR,78030-8.2FT(98.4") Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
533721B02552GSTD,533721B02552G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Extrusion | TO-218, TO-220, TO-247 | Rectangular, Fins | 1.650" (41.91mm) | 1.000" (25.40mm) | - | 1.000" (25.40mm) | 2 Clips and PC Pin | 4.0W @ 30°C | 2.50°C/W @ 500 LFM | 5.70°C/W | Aluminum | Black Anodized |
|
6263B-MT5GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220, TO-218 | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | - | 0.400" (10.16mm) | Bolt On and PC Pin | 6.0W @ 60°C | 6.00°C/W @ 400 LFM | 8.80°C/W | Aluminum | Black Anodized |
|
EA-250-H095-T710STD,EA-250-H095-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-250 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | 0.374" (9.50mm) | Clip | - | 21.60°C/W @ 200 LFM | 54.80°C/W | Aluminum | Black Anodized |
|
241404B91200G241404B91200G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | Quarter Brick DC/DC Converter | Rectangular, Fins | 2.280" (57.90mm) | 1.030" (26.16mm) | - | 0.450" (11.43mm) | Bolt On | - | - | - | - | - |
|
530122B00162GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 (Dual) | Square, Angled Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | - | 1.750" (44.45mm) | Clip and Board Mounts | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.20°C/W | Aluminum | Black Anodized |
|
EA-310-H125-T710STD,EA-310-H125-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-310 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 1.220" (31.00mm) | 1.220" (31.00mm) | - | 0.492" (12.50mm) | Clip | - | 13.80°C/W @ 200 LFM | 35.50°C/W | Aluminum | Black Anodized |
|
533621B02500GSTD,533621B02500G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |