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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
579103V00000G

579103V00000G

STD,579103V00000G

Boyd Laconia, LLC

0 -
579103V00000G

数据表

- Bulk Active Top Mount TO-3 Rectangular 1.125" (28.58mm) 1.540" (39.12mm) - 0.870" (22.10mm) Bolt On 1.5W @ 30°C 6.00°C/W @ 300 LFM - Aluminum Black Anodized
520327B00000G

520327B00000G

STD,520327B00000G

Boyd Laconia, LLC

0 -
520327B00000G

数据表

- Bulk Active Board Level TO-3 Rectangular 1.534" (38.96mm) 1.250" (31.75mm) - 0.500" (12.70mm) Bolt On 3W @ 40°C 3.00°C/W @ 600 LFM 4.70°C/W Aluminum Black Anodized
780301F00000G

780301F00000G

EXTR,78030-8.2FT(98.4")

Boyd Laconia, LLC

0 -
780301F00000G

数据表

- Bulk Active - - - - - - - - - - - - -
533721B02552G

533721B02552G

STD,533721B02552G

Boyd Laconia, LLC

0 -
533721B02552G

数据表

- Bulk Active Board Level, Extrusion TO-218, TO-220, TO-247 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.000" (25.40mm) 2 Clips and PC Pin 4.0W @ 30°C 2.50°C/W @ 500 LFM 5.70°C/W Aluminum Black Anodized
6263B-MT5G

6263B-MT5G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6263B-MT5G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-218 Rectangular, Fins 1.750" (44.45mm) 1.760" (44.70mm) - 0.400" (10.16mm) Bolt On and PC Pin 6.0W @ 60°C 6.00°C/W @ 400 LFM 8.80°C/W Aluminum Black Anodized
EA-250-H095-T710

EA-250-H095-T710

STD,EA-250-H095-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-250-H095-T710

数据表

EA-250 Bulk Active Top Mount BGA, FPGA Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.374" (9.50mm) Clip - 21.60°C/W @ 200 LFM 54.80°C/W Aluminum Black Anodized
241404B91200G

241404B91200G

241404B91200G

Boyd Laconia, LLC

0 -
241404B91200G

数据表

- Bulk Active Top Mount Quarter Brick DC/DC Converter Rectangular, Fins 2.280" (57.90mm) 1.030" (26.16mm) - 0.450" (11.43mm) Bolt On - - - - -
530122B00162G

530122B00162G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
530122B00162G

数据表

- Bulk Active Board Level, Vertical TO-220 (Dual) Square, Angled Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.20°C/W Aluminum Black Anodized
EA-310-H125-T710

EA-310-H125-T710

STD,EA-310-H125-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-310-H125-T710

数据表

EA-310 Bulk Active Top Mount BGA, FPGA Square, Fins 1.220" (31.00mm) 1.220" (31.00mm) - 0.492" (12.50mm) Clip - 13.80°C/W @ 200 LFM 35.50°C/W Aluminum Black Anodized
533621B02500G

533621B02500G

STD,533621B02500G

Boyd Laconia, LLC

0 -
533621B02500G

数据表

- Bulk Active - - - - - - - - - - - - -
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