| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TV100GPRESSED HEATSINK, TV100, ZA4025/ Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 1.654" (42.00mm) | 1.496" (38.00mm) | - | 0.512" (13.00mm) | Bolt On | 8.0W @ 70°C | 7.00°C/W @ 150 LFM | 9.00°C/W | Aluminum | Black Anodized |
|
342946-COPPER SKIVFIN342946 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA, FPGA | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | 0.866" (22.00mm) | Push Pin, Thermal Material | - | - | - | Copper | - |
|
KU-0334-AL-ST-1,2MM-2-VE-SGKU-0334-AL-ST-1,2MM-2-VE-SG Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
KU-FD-0490-ES-ST-1,5MM-SGKU-FD-0490-ES-ST-1,5MM-SG Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
2292BTHM,17368B REV C-G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
KU-SBK-0450-CS-ST-0,6MM-SGKU-SBK-0450-CS-ST-0,6MM-SG Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
533566B42552G533566B42552G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
581102B00000W/2 041476 PINSG581102B00000W/2 041476 PINSG Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
335224B00032G335224B00032G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 0.984" (25.00mm) | 0.985" (25.00mm) | - | 0.390" (9.91mm) | Thermal Tape, Adhesive (Included) | 1.5W @ 50°C | 10.40°C/W @ 200 LFM | 34.00°C/W | Aluminum | Black Anodized |
|
342948-COPPER SKIVFIN342948,REV03(GP) Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA, FPGA | Rectangular, Fins | 2.717" (69.00mm) | 2.756" (70.00mm) | - | 0.551" (14.00mm) | Push Pin, Thermal Material | - | - | - | Copper | - |