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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
533402B02552G

533402B02552G

HEATSINK TO-220 SOLDERPIN/CLIP

Boyd Laconia, LLC

0 -
533402B02552G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.500" (38.10mm) Clip and PC Pin 8.0W @ 40°C 2.00°C/W @ 500 LFM 5.00°C/W Aluminum Black Anodized
780802F00000G

780802F00000G

78080 EXTRUSION 2.36X1.06"X4.1'

Boyd Laconia, LLC

0 -
780802F00000G

数据表

- Box Active Board Level, Vertical, Extrusion - Rectangular, Pin Fins 49.500" (1257.30mm) 1.063" (27.00mm) - 2.362" (60.00mm) PC Pin - - - Aluminum -
605202F00000G

605202F00000G

60520 EXTRUSION 1.295X9.875"X4'

Boyd Laconia, LLC

0 -
605202F00000G

数据表

- Box Active Top Mount, Extrusion - Rectangular, Pin Fins 48.000" (1219.20mm) 9.880" (250.95mm) - 1.310" (33.27mm) Adhesive 15.0W @ 20°C 0.25°C/W @ 700 LFM 0.90°C/W Aluminum -
623352F00000G

623352F00000G

62335 EXTRUSION 1.312X19"X3'

Boyd Laconia, LLC

0 -
623352F00000G

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 19.000" (482.60mm) - 1.312" (33.32mm) Adhesive - - - Aluminum -
241202B92200G

241202B92200G

241202B92200G

Boyd Laconia, LLC

0 -
241202B92200G

数据表

- Bulk Active Top Mount Half Brick DC/DC Converter Rectangular, Fins 2.400" (60.96mm) 2.280" (57.91mm) - 0.240" (6.10mm) Bolt On - 2.00°C/W @ 700 LFM 4.10°C/W - -
364424B00032G

364424B00032G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

0 -
364424B00032G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.579" (40.11mm) 1.575" (40.00mm) - 0.449" (11.40mm) Thermal Tape, Adhesive (Included) 2.0W @ 40°C 6.00°C/W @ 200 LFM 18.40°C/W Aluminum Black Anodized
513001B02500G

513001B02500G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
513001B02500G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-247 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
EA-210-H125-T710

EA-210-H125-T710

STD,EA-210-H125-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-210-H125-T710

数据表

EA-210 Bulk Active Top Mount BGA, FPGA Square, Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.492" (12.50mm) Clip - 19.60°C/W @ 200 LFM 51.60°C/W Aluminum Black Anodized
574802B03700G

574802B03700G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
574802B03700G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.900" (22.86mm) 1.020" (25.91mm) - 0.420" (10.67mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 500 LFM 20.40°C/W Aluminum Black Anodized
374824B60024G

374824B60024G

HEATSINK BGA W/O SOLDER ANCHORS

Boyd Laconia, LLC

0 -
374824B60024G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.984" (25.00mm) Solder Anchor 3.0W @ 40°C 4.30°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
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