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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
725452F00000

725452F00000

62545 EXTRUSION 2.75X14.75"X4'

Boyd Laconia, LLC

21 -
725452F00000

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 48.000" (1219.20mm) 14.750" (374.65mm) - 2.750" (69.85mm) Adhesive - - - Aluminum -
EA-190-H145-T710

EA-190-H145-T710

STD,EA-190-H145-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-190-H145-T710

数据表

EA-190 Bulk Active Top Mount BGA, FPGA Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.571" (14.50mm) Clip - 19.70°C/W @ 200 LFM 50.80°C/W Aluminum Black Anodized
7136DG

7136DG

BOARD LEVEL HEATSINK .515"TO-220

Boyd Laconia, LLC

0 -
7136DG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.848" (21.55mm) 0.520" (13.21mm) - 0.515" (13.08mm) Clip and PC Pin 1.0W @ 30°C 6.00°C/W @ 500 LFM 19.70°C/W Copper Tin
581002B00000

581002B00000

HEATSINK TO-220 4.3W H=1.0 BLK

Boyd Laconia, LLC

0 -
581002B00000

数据表

- Box Active Board Level TO-220 Rectangular, Fins 1.000" (25.40mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On 2.5W @ 50°C 4.00°C/W @ 500 LFM - Aluminum Black Anodized
6396BG

6396BG

HEATSINK TO-218/TO-220 PIN

Boyd Laconia, LLC

0 -
6396BG

数据表

- Bulk Active Board Level, Vertical TO-220, TO-218 Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 4.0W @ 30°C 1.50°C/W @ 600 LFM 5.60°C/W Aluminum Black Anodized
6399BG

6399BG

HEAT SINK

Boyd Laconia, LLC

15 -
6399BG

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 8.0W @ 40°C 1.00°C/W @ 700 LFM 3.30°C/W Aluminum Black Anodized
566010B03400G

566010B03400G

HEATSINK W/TAB BLACK

Boyd Laconia, LLC

0 -
566010B03400G

数据表

- Bulk Active Board Level, Vertical Multiwatt, SIP Rectangular, Fins 1.220" (30.99mm) 1.000" (25.40mm) - 0.500" (12.70mm) Clip and PC Pin 2.0W @ 30°C 4.00°C/W @ 300 LFM 11.50°C/W Aluminum Black Anodized
6400BG

6400BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6400BG

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 2.500" (63.50mm) Bolt On and PC Pin 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W Aluminum Black Anodized
622002F00000G

622002F00000G

62200 EXTRUSION 0.85X3.5"X4'

Boyd Laconia, LLC

0 -
622002F00000G

数据表

- Box Active Top Mount, Extrusion - Rectangular, Pin Fins 48.000" (1219.20mm) 3.500" (88.90mm) - 0.850" (21.60mm) Adhesive - 1.50°C/W @ 200 LFM - Aluminum -
530002B02500G

530002B02500G

HEATSINK TO-220 POWER W/PINS BK

Boyd Laconia, LLC

0 -
530002B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 20.0W @ 60°C 2.00°C/W @ 300 LFM 2.60°C/W Aluminum Black Anodized
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