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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
513002B02500G

513002B02500G

HEATSINK TO-220 W/PINS 1" TALL

Boyd Laconia, LLC

0 -
513002B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
577304B00000G

577304B00000G

HEATSINK TO-202 LOW PROFILE.375"

Boyd Laconia, LLC

14 -
577304B00000G

数据表

- Bag Active Board Level TO-202 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) Bolt On 1.0W @ 30°C 8.00°C/W @ 500 LFM 27.20°C/W Aluminum Black Anodized
374324B00035G

374324B00035G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

0 -
374324B00035G

数据表

37432 Box Active Board Level BGA, FPGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 3.0W @ 90°C 9.30°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
374624B00032G

374624B00032G

HEATSINK BGA 35X35X10MM W/ADH

Boyd Laconia, LLC

0 -
374624B00032G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 1.5W @ 40°C 7.60°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
375024B00032G

375024B00032G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

0 -
375024B00032G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.01mm) - 0.709" (18.00mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 4.30°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
563002D00000G

563002D00000G

HEATSINK TO-220 TAB TIN

Boyd Laconia, LLC

0 -
563002D00000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.00°C/W - Tin
374124B00035G

374124B00035G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

0 -
374124B00035G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 0.906" (23.01mm) 0.906" (23.01mm) - 0.709" (18.00mm) Thermal Tape, Adhesive (Included) 2.0W @ 50°C 7.40°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
533101B02551G

533101B02551G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533101B02551G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-247 Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) Clip and PC Pin 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
6225B-MTG

6225B-MTG

HEATSINK TO-220 TAB BLACK

Boyd Laconia, LLC

0 -
6225B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.070" (27.18mm) 1.024" (26.00mm) - 0.315" (8.00mm) Bolt On and PC Pin 2.0W @ 40°C 3.00°C/W @ 700 LFM 15.00°C/W Aluminum Black Anodized
531202B02100G

531202B02100G

HEATSINK TO-220 SOLDERPIN 50.8MM

Boyd Laconia, LLC

0 -
531202B02100G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-202 Rectangular, Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 8.0W @ 60°C 4.00°C/W @ 600 LFM 7.50°C/W Aluminum Black Anodized
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