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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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APH-0430-T-HAPH-0430-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0930-T-HAPH-0930-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1430-T-HAPH-1430-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1030-T-HAPH-1030-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0630-T-HAPH-0630-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0830-T-HAPH-0830-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0730-T-HAPH-0730-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0230-T-HAPH-0230-T-H |
0 | - |
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数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0330-T-HAPH-0330-T-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
116-47-636-41-006000STANDRD SOLDRTL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-41-324-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-41-424-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-41-624-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-91-324-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-91-424-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-91-624-31-012000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-41-320-41-002000CONN IC SKT DBL |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-41-420-41-002000CONN IC SKT DBL |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-91-320-41-002000CONN IC SKT DBL |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-91-420-41-002000CONN IC SKT DBL |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
