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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1326-T-H

APH-1326-T-H

APH-1326-T-H

Samtec Inc.

0 -
APH-1326-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0226-T-H

APH-0226-T-H

APH-0226-T-H

Samtec Inc.

0 -
APH-0226-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1826-T-H

APH-1826-T-H

APH-1826-T-H

Samtec Inc.

0 -
APH-1826-T-H

数据表

* - Active - - - - - - - - - - - - - - -
317-47-119-41-005000

317-47-119-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-119-41-005000

数据表

317 Bulk Active SIP 19 (1 x 19) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-318-G-N

APA-318-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-318-G-N

数据表

APA Tube Active - 18 (2 x 9) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
115-93-322-41-001000

115-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-422-41-001000

115-93-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-322-41-001000

115-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-422-41-001000

115-43-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-328-41-001000

111-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-328-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-628-41-001000

111-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-628-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-328-41-001000

111-91-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-328-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-428-41-001000

111-91-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-428-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-628-41-001000

111-91-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-628-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
3-1437508-6

3-1437508-6

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
3-1437508-6

数据表

8058 Bulk Obsolete Transistor, TO-5 8 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
28-3518-01

28-3518-01

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3518-01

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-99-650-41-001000

110-99-650-41-001000

CONN IC DIP SOCKET 50POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-650-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-628-WGG

ICA-628-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-WGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
104-13-210-41-770000

104-13-210-41-770000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-210-41-770000

数据表

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
121-13-310-41-001000

121-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-310-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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