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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFB008R24C2E3E

AGFB008R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB008R24C2E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB008R24C2E2VB

AGFB008R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB008R24C2E2VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA019R25A3E3E

AGFA019R25A3E3E

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFA019R25A3E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB019R25A3E3E

AGFB019R25A3E3E

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFB019R25A3E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA008R24C2I3V

AGFA008R24C2I3V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA008R24C2I3V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFB008R24C2I3V

AGFB008R24C2I3V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB008R24C2I3V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA006R16A2I1V

AGFA006R16A2I1V

IC FPGA AGILEX-F 1546FBGA

Intel

0 -
AGFA006R16A2I1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA006R16A2I1VB

AGFA006R16A2I1VB

IC FPGA AGILEX-F 1546BGA

Intel

0 -
AGFA006R16A2I1VB

数据表

Agilex F 1546-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements - -40°C ~ 100°C (TJ) - - 1546-BGA (37.5x34)
1SX110HN3F43I3XG

1SX110HN3F43I3XG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX110HN3F43I3XG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1100K Logic Elements - -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX165HN2F43E2VG

1SX165HN2F43E2VG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX165HN2F43E2VG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1650K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
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