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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFB012R24C3I3V

AGFB012R24C3I3V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB012R24C3I3V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA012R24B2E2V

AGFA012R24B2E2V

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFA012R24B2E2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA012R24B2E3E

AGFA012R24B2E3E

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFA012R24B2E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB012R24B2E3E

AGFB012R24B2E3E

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFB012R24B2E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB012R24B2E2V

AGFB012R24B2E2V

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFB012R24B2E2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX085HN1F43E2LG

1SX085HN1F43E2LG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX085HN1F43E2LG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 850K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX250HH3F55E3VG

1SX250HH3F55E3VG

IC FPGA STRATIX 10 2912FBGA

Intel

0 -
1SX250HH3F55E3VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX110HN3F43I2LG

1SX110HN3F43I2LG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX110HN3F43I2LG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1100K Logic Elements - -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX110HN2F43E2LG

1SX110HN2F43E2LG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX110HN2F43E2LG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1100K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX250LN3F43E3VG

1SX250LN3F43E3VG

IC SOC CORTEX-A53 1.5GHZ 1760BGA

Intel

0 -
1SX250LN3F43E3VG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA, FC (42.5x42.5)
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