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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFB014R24B2E3V

AGFB014R24B2E3V

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFB014R24B2E3V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB014R24B3I3E

AGFB014R24B3I3E

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFB014R24B3I3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFB014R24B2E4F

AGFB014R24B2E4F

IC FPGA AGILEX-F 2486FBGA

Intel

0 -
AGFB014R24B2E4F

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB012R24D2E3V

AGFB012R24D2E3V

AGFB012R24D2E3V

Intel

0 -
AGFB012R24D2E3V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB006R24C2E1V

AGFB006R24C2E1V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB006R24C2E1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB006R24C2E1VB

AGFB006R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB006R24C2E1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB006R16A2E4X

AGFB006R16A2E4X

IC FPGA AGILEX-F 1546FBGA

Intel

0 -
AGFB006R16A2E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA019R24C3E3V

AGFA019R24C3E3V

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFA019R24C3E3V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C3E3V

AGFB019R24C3E3V

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB019R24C3E3V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA012R24C3I3V

AGFA012R24C3I3V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA012R24C3I3V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements - -40°C ~ 100°C (TJ) - - -
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