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微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
R7S921041VCBG#BC0

R7S921041VCBG#BC0

IC MPU RZ/A2M 528MHZ 256LFBGA

Renesas Electronics Corporation

0 -
R7S921041VCBG#BC0

数据表

256-LFBGA RZ/A2M Tray Active ARM® Cortex®-A9 1 Core, 32-Bit Multimedia; NEON™ MPE - Yes Surface Mount LCD, LVDS, MIPICSI2, Video - 528MHz - USB 2.0 (1) AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 - 256-LFBGA (11x11) - -40°C ~ 85°C (TA) - CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R9A08G045S13GBG#AC0

R9A08G045S13GBG#AC0

SOC RZ/G3S 14BGA NON-SECURE 1+1C

Renesas Electronics Corporation

0 -
R9A08G045S13GBG#AC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) - 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
R9A08G045S37GBG#BC0

R9A08G045S37GBG#BC0

SOC RZ/G3S 14BGA SECURE 1+2CPU(F

Renesas Electronics Corporation

0 -
R9A08G045S37GBG#BC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
R7S921042VCBG#BC0

R7S921042VCBG#BC0

IC MPU RZ/A2M 528MHZ 272FBGA

Renesas Electronics Corporation

0 -
R7S921042VCBG#BC0

数据表

272-FBGA RZ/A2M Tray Active ARM® Cortex®-A9 1 Core, 32-Bit Multimedia; NEON™ MPE - Yes Surface Mount LCD, LVDS, MIPICSI2, Video - 528MHz - USB 2.0 (1) AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 - 272-FBGA (17x17) - -40°C ~ 85°C (TA) - CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R9A08G045S17GBG#AC0

R9A08G045S17GBG#AC0

SOC RZ/G3S 14BGA SECURE 1+1CPU(B

Renesas Electronics Corporation

0 -
R9A08G045S17GBG#AC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
R7S921052VCBG#BC0

R7S921052VCBG#BC0

IC MPU RZ/A2M 528MHZ 272FBGA

Renesas Electronics Corporation

0 -
R7S921052VCBG#BC0

数据表

272-FBGA RZ/A2M Tray Active ARM® Cortex®-A9 1 Core, 32-Bit Multimedia; NEON™ MPE - Yes Surface Mount LCD, LVDS, MIPICSI2, Video - 528MHz - USB 2.0 (1) AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 - 272-FBGA (17x17) - -40°C ~ 85°C (TA) - CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R9A07G074M01GBG#AC0

R9A07G074M01GBG#AC0

RZ/T2L MPU BGA196 NON-ETHERCAT N

Renesas Electronics Corporation

168 -
R9A07G074M01GBG#AC0

数据表

196-LFBGA RZ/T2L Tray Active ARM® Cortex®-R52 1 Core, 32-Bit - SDRAM No Surface Mount - 10/100/1000Mbps (1) 800MHz - USB 3.0 (2) AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG 3.3V 196-LFBGA (12x12) - -40°C ~ 125°C (TJ) - CANbus, DMA, GPIO, I2C, SCI, SPI, USB
R9A07G044L14GBG#BC0

R9A07G044L14GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA

Renesas Electronics Corporation

0 -
R9A07G044L14GBG#BC0

数据表

551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) - 1.8V, 3.3V 551-LFBGA (21x21) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044L24GBG#BC0

R9A07G044L24GBG#BC0

SOC RZ/G2L 21MMBGA NON-SECUE DUA

Renesas Electronics Corporation

0 -
R9A07G044L24GBG#BC0

数据表

551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 3 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI-CSI, MIPI-DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) - 1.8V, 3.3V 551-LFBGA (21x21) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044L18GBG#BC0

R9A07G044L18GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA

Renesas Electronics Corporation

0 -
R9A07G044L18GBG#BC0

数据表

551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) AES, RSA, SHA-1, SHA-224, SHA-256, TRNG 1.8V, 3.3V 551-LFBGA (21x21) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
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