| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 核心处理器 | 核心数量/总线宽度 | 协处理器/DSP | RAM 控制器 | 图形加速 | 安装类型 | 显示和接口控制器 | 以太网 | 速度 | SATA | USB | 安全特性 | 电压 - I/O | 供应商设备封装 | 认证 | 工作温度 | 等级 | 附加接口 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R8A774A0HA01BG#G2IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA Renesas Electronics Corporation |
0 | - |
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数据表 |
1022-BGA | RZ/G2M | Tray | Active | ARM® Cortex®-A53, ARM® Cortex®-A57 | 6 Core, 64-Bit | - | LPDDR4 | No | Surface Mount | DU | 10/100Mbps (1), 100/1000Mbps (1) | 1.2GHz, 1.5GHz | - | USB (2) | - | 0.82V, 1.8V, 3.3V | 1022-FPBGA (29x29) | - | -40°C ~ 85°C (TA) | - | CAN, I2C, SCI, SPI |
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R8A774B0HA01BG#G0IC MPU RZ/G2N 1.5GHZ 1022FPBGA Renesas Electronics Corporation |
169 | - |
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数据表 |
1022-BGA | RZ/G2N | Tray | Active | ARM® Cortex®-A57 | 2 Core, 64-Bit | - | LPDDR4 | No | Surface Mount | DU | 10/100Mbps (1), 100/1000Mbps (1) | 1.5GHz | - | USB (2) | - | 0.82V, 1.8V, 3.3V | 1022-FPBGA | - | -40°C ~ 85°C (TA) | - | CAN, I2C, SCI, SPI |
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R8A77430HA02BG#UAIC MPU RZ/G/G1M 1.5GHZ Renesas Electronics Corporation |
32 | - |
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数据表 |
- | RZ/G/G1M | Tray | Active | - | - | - | - | - | - | - | - | 1.5GHz | - | - | - | - | - | - | - | - | - |
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R8A77420HA02BG#UAIC MPU RZ/G/G1H Renesas Electronics Corporation |
80 | - |
|
数据表 |
- | RZ/G/G1H | Tray | Active | Quad ARM® Cortex®-A7, Quad ARM® Cortex®-A15 | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | USB 2.0 (2), USB 3.0 (1) | - | - | - | - | - | - | - |
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R8A774E0HA01BN#G0IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA Renesas Electronics Corporation |
180 | - |
|
数据表 |
1022-BGA | RZ/G2E | Tray | Active | ARM® Cortex®-A53, ARM® Cortex®-A57 | 8 Core, 64-Bit | - | LPDDR4 | No | Surface Mount | DU | 10/100Mbps (1), 100/1000Mbps (1) | 1.2GHz, 1.5GHz | - | USB (4) | - | 0.82V, 1.8V, 3.3V | 1022-FPBGA | - | -40°C ~ 85°C (TA) | - | CAN, I2C, SCI, SPI |
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R9A07G063U01GBG#BC0IC MPU RZ/A3UL 1GHZ 361PBGA Renesas Electronics Corporation |
0 | - |
|
数据表 |
361-BGA | RZ/A3UL | Tray | Active | ARM® Cortex®-A55 | 1 Core, 64-Bit | - | DDR3L, DDR4 | No | Surface Mount | LCD, MIPI/CSI2 | 10/100/1000Mbps (2) | 1GHz | - | USB 2.0 (2) | - | 1.1V, 1.8V, 3.3V | 361-PBGA (13x13) | - | -40°C ~ 85°C (TA) | - | CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART |
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R9A07G043U12GBG#BC0IC MPU RZ/G 200MHZ/1GHZ 361LFBGA Renesas Electronics Corporation |
0 | - |
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数据表 |
361-LFBGA | RZ/G | Tray | Active | ARM® Cortex®-A55, ARM® Cortex®-M33 | 4 Core, 64-Bit | Multimedia; NEON™ SIMD | DDR4, DDR3L | No | Surface Mount | LCD | GbE (2) | 200MHz, 1GHz | - | USB 2.0 (2) | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | 1.8V, 3.3V | 361-BGA (13x13) | - | -40°C ~ 85°C (TA) | - | CANbus, eMMC/SD/SDIO, I2C, SPI, UART |
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R9A07G043F04GBG#BC0IC MPU RZ/G 1GHZ 266LFBGA Renesas Electronics Corporation |
0 | - |
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数据表 |
266-LFBGA | RZ/G | Tray | Active | AndesCore™ AX45MP | 1 Core, 16-Bit | - | DDR3L, DDR4 | No | Surface Mount | - | GbE (1) | 1GHz | - | USB 2.0 (2) | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | - | 266-LFBGA (11x11) | - | -40°C ~ 85°C (TA) | - | CANbus, eMMC/SD/SDIO, I2C, SPI, UART |
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R9A07G063U02GBG#BC0IC MPU RZ/A3UL 1GHZ 361PBGA Renesas Electronics Corporation |
0 | - |
|
数据表 |
361-BGA | RZ/A3UL | Tray | Active | ARM® Cortex®-A55 | 1 Core, 64-Bit | - | DDR3L, DDR4 | No | Surface Mount | LCD, MIPI/CSI2 | 10/100/1000Mbps (2) | 1GHz | - | USB 2.0 (2) | - | 1.1V, 1.8V, 3.3V | 361-PBGA (13x13) | - | -40°C ~ 85°C (TA) | - | CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART |
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R9A07G043U15GBG#BC0IC MPU RZ/G2UL 1GHZ 361BGA Renesas Electronics Corporation |
0 | - |
|
数据表 |
361-LFBGA | RZ/G2UL | Tray | Active | ARM® Cortex®-A7 | 1 Core, 64-Bit | ARM® Cortex®-M33 | DDR3L, DDR4 | No | Surface Mount | LCD | 10/100/1000Mbps (2) | 1GHz | - | USB 2.0 OTG (2) | AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG | 3.3V | 361-BGA (13x13) | - | -40°C ~ 85°C (TA) | - | CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI |