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微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
R8A774A0HA01BG#G2

R8A774A0HA01BG#G2

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

Renesas Electronics Corporation

0 -
R8A774A0HA01BG#G2

数据表

1022-BGA RZ/G2M Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 6 Core, 64-Bit - LPDDR4 No Surface Mount DU 10/100Mbps (1), 100/1000Mbps (1) 1.2GHz, 1.5GHz - USB (2) - 0.82V, 1.8V, 3.3V 1022-FPBGA (29x29) - -40°C ~ 85°C (TA) - CAN, I2C, SCI, SPI
R8A774B0HA01BG#G0

R8A774B0HA01BG#G0

IC MPU RZ/G2N 1.5GHZ 1022FPBGA

Renesas Electronics Corporation

169 -
R8A774B0HA01BG#G0

数据表

1022-BGA RZ/G2N Tray Active ARM® Cortex®-A57 2 Core, 64-Bit - LPDDR4 No Surface Mount DU 10/100Mbps (1), 100/1000Mbps (1) 1.5GHz - USB (2) - 0.82V, 1.8V, 3.3V 1022-FPBGA - -40°C ~ 85°C (TA) - CAN, I2C, SCI, SPI
R8A77430HA02BG#UA

R8A77430HA02BG#UA

IC MPU RZ/G/G1M 1.5GHZ

Renesas Electronics Corporation

32 -
R8A77430HA02BG#UA

数据表

- RZ/G/G1M Tray Active - - - - - - - - 1.5GHz - - - - - - - - -
R8A77420HA02BG#UA

R8A77420HA02BG#UA

IC MPU RZ/G/G1H

Renesas Electronics Corporation

80 -
R8A77420HA02BG#UA

数据表

- RZ/G/G1H Tray Active Quad ARM® Cortex®-A7, Quad ARM® Cortex®-A15 - - - - - - - - SATA 3Gbps (2) USB 2.0 (2), USB 3.0 (1) - - - - - - -
R8A774E0HA01BN#G0

R8A774E0HA01BN#G0

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

Renesas Electronics Corporation

180 -
R8A774E0HA01BN#G0

数据表

1022-BGA RZ/G2E Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 8 Core, 64-Bit - LPDDR4 No Surface Mount DU 10/100Mbps (1), 100/1000Mbps (1) 1.2GHz, 1.5GHz - USB (4) - 0.82V, 1.8V, 3.3V 1022-FPBGA - -40°C ~ 85°C (TA) - CAN, I2C, SCI, SPI
R9A07G063U01GBG#BC0

R9A07G063U01GBG#BC0

IC MPU RZ/A3UL 1GHZ 361PBGA

Renesas Electronics Corporation

0 -
R9A07G063U01GBG#BC0

数据表

361-BGA RZ/A3UL Tray Active ARM® Cortex®-A55 1 Core, 64-Bit - DDR3L, DDR4 No Surface Mount LCD, MIPI/CSI2 10/100/1000Mbps (2) 1GHz - USB 2.0 (2) - 1.1V, 1.8V, 3.3V 361-PBGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
R9A07G043U12GBG#BC0

R9A07G043U12GBG#BC0

IC MPU RZ/G 200MHZ/1GHZ 361LFBGA

Renesas Electronics Corporation

0 -
R9A07G043U12GBG#BC0

数据表

361-LFBGA RZ/G Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 4 Core, 64-Bit Multimedia; NEON™ SIMD DDR4, DDR3L No Surface Mount LCD GbE (2) 200MHz, 1GHz - USB 2.0 (2) AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG 1.8V, 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G043F04GBG#BC0

R9A07G043F04GBG#BC0

IC MPU RZ/G 1GHZ 266LFBGA

Renesas Electronics Corporation

0 -
R9A07G043F04GBG#BC0

数据表

266-LFBGA RZ/G Tray Active AndesCore™ AX45MP 1 Core, 16-Bit - DDR3L, DDR4 No Surface Mount - GbE (1) 1GHz - USB 2.0 (2) AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG - 266-LFBGA (11x11) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G063U02GBG#BC0

R9A07G063U02GBG#BC0

IC MPU RZ/A3UL 1GHZ 361PBGA

Renesas Electronics Corporation

0 -
R9A07G063U02GBG#BC0

数据表

361-BGA RZ/A3UL Tray Active ARM® Cortex®-A55 1 Core, 64-Bit - DDR3L, DDR4 No Surface Mount LCD, MIPI/CSI2 10/100/1000Mbps (2) 1GHz - USB 2.0 (2) - 1.1V, 1.8V, 3.3V 361-PBGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
R9A07G043U15GBG#BC0

R9A07G043U15GBG#BC0

IC MPU RZ/G2UL 1GHZ 361BGA

Renesas Electronics Corporation

0 -
R9A07G043U15GBG#BC0

数据表

361-LFBGA RZ/G2UL Tray Active ARM® Cortex®-A7 1 Core, 64-Bit ARM® Cortex®-M33 DDR3L, DDR4 No Surface Mount LCD 10/100/1000Mbps (2) 1GHz - USB 2.0 OTG (2) AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI
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