富聪科技订单满¥1000免运费
关注我们:

微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
R9A07G043U11GBG#BC0

R9A07G043U11GBG#BC0

IC MPU RZ/G 200MHZ/1GHZ 361BGA

Renesas Electronics Corporation

781 -
R9A07G043U11GBG#BC0

数据表

361-LFBGA RZ/G Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 4 Core, 64-Bit Multimedia; NEON™ SIMD DDR4, DDR3L No Surface Mount LCD GbE (2) 200MHz, 1GHz - USB 2.0 (2) AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG 1.8V, 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G043U11GBG#AC0

R9A07G043U11GBG#AC0

IC MPU RZ/G 200MHZ/1GHZ 361BGA

Renesas Electronics Corporation

168 -
R9A07G043U11GBG#AC0

数据表

361-LFBGA RZ/G Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 4 Core, 64-Bit Multimedia; NEON™ SIMD DDR4, DDR3L No Surface Mount LCD GbE (2) 200MHz, 1GHz - USB 2.0 (2) AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG 1.8V, 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A08G045S15GBG#BC0

R9A08G045S15GBG#BC0

SOC RZ/G3S 13BGA SECURE(FULL)

Renesas Electronics Corporation

0 -
R9A08G045S15GBG#BC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A08G045S11GBG#AC0

R9A08G045S11GBG#AC0

SOC RZ/G3S 13BGA NON-SECURE 1+1C

Renesas Electronics Corporation

0 -
R9A08G045S11GBG#AC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) - 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A07G044L17GBG#BC0

R9A07G044L17GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA

Renesas Electronics Corporation

0 -
R9A07G044L17GBG#BC0

数据表

456-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) AES, RSA, SHA-1, SHA-224, SHA-256, TRNG 1.8V, 3.3V 456-LFBGA (15x15) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044C12GBG#BC0

R9A07G044C12GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 361BGA

Renesas Electronics Corporation

952 -
R9A07G044C12GBG#BC0

数据表

361-LFBGA RZ/G2LC Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) - 1.8V, 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044C12GBG#AC0

R9A07G044C12GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 361BGA

Renesas Electronics Corporation

119 -
R9A07G044C12GBG#AC0

数据表

361-LFBGA RZ/G2LC Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit ARM® Mali-G31 DDR3L, DDR4 No Surface Mount MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) 200MHz, 1.2GHz - USB 2.0 (2) - 1.8V, 3.3V 361-BGA (13x13) - -40°C ~ 85°C (TA) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A08G045S35GBG#BC0

R9A08G045S35GBG#BC0

SOC RZ/G3S 13BGA SECURE 1+2CPU(F

Renesas Electronics Corporation

0 -
R9A08G045S35GBG#BC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A06G043GBG#AC0

R9A06G043GBG#AC0

IC MPU 150MHZ 196LFBGA

Renesas Electronics Corporation

168 -
R9A06G043GBG#AC0

数据表

196-LFBGA - Tray Active ARM® Cortex®-R4 1 Core, 32-Bit - - No Surface Mount - EtherCAT (2) 150MHz - USB 2.0 (1) - 3.3V 196-LFBGA (12x12) - -40°C ~ 125°C (TJ) - CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R9A08G045S15GBG#AC0

R9A08G045S15GBG#AC0

SOC RZ/G3S 13BGA SECURE(BULK)

Renesas Electronics Corporation

0 -
R9A08G045S15GBG#AC0

数据表

361-LFBGA RZ/G3S Tray Active ARM® Cortex®-A55 1 Core, 64-Bit ARM® Cortex®-M33 DDR4, LPDDR4 No Surface Mount - 10/100/1000Mbps (2) 1.1GHz - USB 2.0 OTG (2) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 1.8V, 3.3V 361-LFBGA (13x13) - -40°C ~ 85°C (TA) - DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
共 364 条记录«上一页1... 7891011121314...37下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户