| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 协处理器 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0820-04-4DI21MAMPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Bulk | Active | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 1 x 60 Pin, 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Zynq™ UltraScale+™ XCZU4EV-1SFVC784I | -40°C ~ 85°C |
|
TE0741-05-D2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0741-05-B2C-1-AFMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0745-02-91C31-AMOD SOM DDR3L 1GB Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM Cortex-A9 | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Zynq-7000 (Z-7045) | -40°C ~ 85°C |
|
TE0817-01-4BE21-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
0 | - |
|
数据表 |
Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | 0°C ~ 85°C |
|
TE0820-05-4DI81MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0807-03-4BE21-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | 0°C ~ 85°C |
|
TE0807-03-4BE21-AKMPSOC MODULE TE0807 WITH ZYNQ UL Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | 0°C ~ 85°C |
|
TE0808-05-6BE21-LULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | 0°C ~ 85°C |
|
TE0808-05-6BE81-LULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |