| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 锁相环(PLL) | 输入 | 输出 | 电路数量 | 输入:输出比 | 差分 - 输入:输出 | 主要用途 | 最大频率 | 电压 - 电源 | 供应商设备封装 | 工作温度 | 认证 | 安装类型 | 等级 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZL30733ALDG13-CHANNEL, 10-OUTPUT 1588 TIMING Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | - | CMOS | 1 | 5:10 | Yes/Yes | Memory | 750MHz | 1.8V, 3.3V | 64-VQFN (9x9) | -40°C ~ 85°C | - | Surface Mount | - |
|
ZL30735ALDG1FIVE-CHANNEL, 10-OUTPUT 1588 TIM Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | - | CMOS | 1 | 5:10 | Yes/Yes | Memory | 750MHz | 1.8V, 3.3V | 64-VQFN (9x9) | -40°C ~ 85°C | - | Surface Mount | - |
|
ZL30634ALDG1Q09FZL30634ALDG1Q09F Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | Ethernet, SONET/SDH, Wireless Base Stations | 750MHz | 1.8V, 3.3V | 64-VQFN (9x9) | -40°C ~ 85°C | - | Surface Mount | - |
|
ZL30271LDG1Q0BKZL30271LDG1Q0BK Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | CMOS, Crystal | CMOS, LVDS, LVPECL | 1 | 3:10 | No/Yes | Memory, PCI Express (PCIe), SONET/SDH | 750MHz | 1.71V ~ 1.89V, 3.135V ~ 3.465V | 64-QFN (9x9) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0344FL1VAO2-OUTPUT AUTOMOTIVE GRADE MEMS P Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | - | Yes | - | HCSL | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 105°C (TA) | - | Surface Mount | - |
|
SM806037UMG-TR156.25 LVPECL X 4 Microchip Technology |
0 | - |
|
数据表 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | Yes | Crystal | LVPECL | 1 | 1:4 | No/Yes | Ethernet, Fiber Channel | 625MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | 48-VQFN (7x7) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0334FI1VAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | - | Yes | - | HCSL, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0334FI1TVAO2-OUTPUT AUTO GRADE MEMS PCIE CL Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | Yes | - | HCSL, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0344FL1TVAO2-OUTPUT AUTOMOTIVE GRADE MEMS P Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | Yes | - | HCSL | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 105°C (TA) | - | Surface Mount | - |
|
090-44570-01MAC-SA57 (ULTRA-HIGH PERFORMANCE Microchip Technology |
0 | - |
|
数据表 |
- | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |