| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 锁相环(PLL) | 输入 | 输出 | 电路数量 | 输入:输出比 | 差分 - 输入:输出 | 主要用途 | 最大频率 | 电压 - 电源 | 供应商设备封装 | 工作温度 | 认证 | 安装类型 | 等级 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DSA557-0344FL0TVAO2-OUTPUT AUTO GRADE MEMS PCIE CL Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 105°C (TA) | - | Surface Mount | - |
|
DSA557-0344FL0VAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 105°C (TA) | - | Surface Mount | - |
|
DSA557-0344FI0TVAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0333FL1VAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 105°C (TA) | - | Surface Mount | - |
|
DSA557-0344FI1VAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0344FI0VAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
DSA557-0344FI1TVAO2-OUTPUT AUTOMTIVE GRADE MEMS PC Microchip Technology |
0 | - |
|
数据表 |
DSA557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | PCI Express (PCIe) | 100MHz | 2.25V ~ 3.63V | 14-QFN (2.5x3.2) | -40°C ~ 85°C (TA) | - | Surface Mount | - |
|
ZL30795LFG7ENHANCED DUAL 1588 TIMING CARD Microchip Technology |
0 | - |
|
数据表 |
- | 80-VFLGA | Tray | Active | Not Verified | Yes | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 2 | 5:10 | Yes/Yes | Ethernet, SONET/SDH, Wireless Base Stations | 1.045GHz | 1.8V, 3.3V | 80-LGA (11x11) | -40°C ~ 85°C | - | Surface Mount | - |
|
|
ZL80032LDG1TWO-CHANNEL SYNCE TIMING CARD IC Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | - | CMOS | 5 | 10:10 | Yes/Yes | - | 750MHz | 1.8V, 3.3V | 64-VQFN (9x9) | -40°C ~ 85°C | - | Surface Mount | - |
|
ZL30732ALDG12-CHANNEL, 10-OUTPUT 1588 TIMING Microchip Technology |
0 | - |
|
数据表 |
- | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | - | CMOS | 1 | 5:10 | Yes/Yes | Memory | 750MHz | 1.8V, 3.3V | 64-VQFN (9x9) | -40°C ~ 85°C | - | Surface Mount | - |