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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
901-19-1-28-2-B-0

901-19-1-28-2-B-0

HEAT SINK ELLIP FIN 19X19MM CLIP

Wakefield-Vette

192 -
901-19-1-28-2-B-0

数据表

901 Box Active Top Mount BGA Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 1.087" (27.60mm) Push Pin - 4.91°C/W @ 200 LFM 10.30°C/W Aluminum Black Anodized
B-375-120-62G

B-375-120-62G

HEAT SINK

Boyd Laconia, LLC

4,942 -
B-375-120-62G

数据表

- Bulk Active - - - - - - - - - - - - -
MTN-264-55

MTN-264-55

HEATSINK TO-247/TO-264 W/CLIP

Wakefield-Vette

1,460 -
MTN-264-55

数据表

Mountain Box Active Top Mount TO-247, TO-264 Rectangular, Fins 1.060" (26.92mm) 1.740" (44.20mm) - 1.555" (39.50mm) Clip - - - Aluminum Black Anodized
PA-T22-38E

PA-T22-38E

DUAL PIN FIN HEATSINK 2 CLIPS

Ohmite

971 -
PA-T22-38E

数据表

P Box Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Pin Fins 2.170" (55.12mm) 1.240" (31.50mm) - 1.520" (38.61mm) 2 Clips and PC Pin - - 3.13°C/W Aluminum Black Anodized
ATS-54425D-C1-R0

ATS-54425D-C1-R0

HEAT SINK 42.5 X 42.5 X 9.5MM

Advanced Thermal Solutions Inc.

120 -
ATS-54425D-C1-R0

数据表

- Bulk Active Top Mount BGA Square, Fins 1.673" (42.50mm) 1.673" (42.49mm) - 0.374" (9.50mm) Thermal Tape, Adhesive (Included) - 8.40°C/W @ 200 LFM - Aluminum Black Anodized
RAS-HS-C

RAS-HS-C

HEATSINK RASPBERRY PI ALUM/COP

Micro Connectors, Inc.

1,492 -
RAS-HS-C

数据表

- Retail Package Active Top Mount Kit Raspberry Pi 2B, 3B, 3B+, 4B, B+ Rectangular, Fins; Square, Fins - - - - Thermal Tape, Adhesive (Included) - - - Aluminum, Copper -
MTN-264-27

MTN-264-27

HEATSINK TO-247/TO-264 W/CLIP

Wakefield-Vette

3,978 -
MTN-264-27

数据表

Mountain Box Active Top Mount TO-247, TO-264 Rectangular, Fins 1.060" (26.92mm) 1.740" (44.20mm) - 1.555" (39.50mm) Clip - - - Aluminum Black Anodized
ATS-12A-32-C1-R0

ATS-12A-32-C1-R0

HEATSINK 57.9X36.83X11.43MM

Advanced Thermal Solutions Inc.

283 -
ATS-12A-32-C1-R0

数据表

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Rectangular, Fins 2.280" (57.90mm) 1.450" (36.83mm) - 0.450" (11.43mm) Push Pin - 21.45°C/W @ 100 LFM - Aluminum Blue Anodized
OMNI-UNI-34-75

OMNI-UNI-34-75

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

672 -
OMNI-UNI-34-75

数据表

OmniKlip™ Bulk Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Fins 2.953" (75.00mm) 1.339" (34.00mm) - 2.953" (75.00mm) Clip, Solder Foot - - - Aluminum Black Anodized
OMNI-220-18-50-2C

OMNI-220-18-50-2C

HEATSINK 18X50MM 2-CLIP TO-220

Wakefield-Vette

978 -
OMNI-220-18-50-2C

数据表

OmniKlip™ Tray Active Board Level, Vertical TO-220 Rectangular, Fins 1.969" (50.00mm) 0.710" (18.03mm) - 1.500" (38.10mm) Clip, Solder Foot - - - Aluminum Black Anodized
321127B00000G

321127B00000G

HEATSINK

Boyd Laconia, LLC

400 -
321127B00000G

数据表

- Bulk Active - - - - - - - - - - - - -
OMNI-UNI-40-75-D

OMNI-UNI-40-75-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

884 -
OMNI-UNI-40-75-D

数据表

OmniKlip™ Bulk Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Fins 2.953" (75.00mm) 1.575" (40.00mm) - 2.953" (75.00mm) Clip, Solder Foot - - - Aluminum Black Anodized
ATS-52425B-C1-R0

ATS-52425B-C1-R0

HEAT SINK 42.5 X 42.5 X 7.5MM

Advanced Thermal Solutions Inc.

208 -
ATS-52425B-C1-R0

数据表

maxiFLOW Bulk Active Top Mount BGA Square, Angled Fins 1.673" (42.50mm) 1.673" (42.49mm) - 0.295" (7.50mm) Thermal Tape, Adhesive (Included) - 4.30°C/W @ 200 LFM - Aluminum Blue Anodized
ATS-H1-129-C2-R0

ATS-H1-129-C2-R0

HEATSINK 60X60X10MM XCUT T766

Advanced Thermal Solutions Inc.

294 -
ATS-H1-129-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.394" (10.00mm) Push Pin - 8.65°C/W @ 100 LFM - Aluminum Blue Anodized
ATS-06F-37-C2-R0

ATS-06F-37-C2-R0

HEATSINK 36.83X57.6X17.78MM T766

Advanced Thermal Solutions Inc.

279 -
ATS-06F-37-C2-R0

数据表

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Rectangular, Fins 1.450" (36.83mm) 2.267" (57.60mm) - 0.700" (17.78mm) Push Pin - 9.12°C/W @ 100 LFM - Aluminum Blue Anodized
ATS-H1-175-C2-R0

ATS-H1-175-C2-R0

HEATSINK 35X35X10MM R-TAB T766

Advanced Thermal Solutions Inc.

298 -
ATS-H1-175-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) Push Pin - 13.52°C/W @ 100 LFM - Aluminum Blue Anodized
RPIHS-03

RPIHS-03

RASPBERRY PI COPPER HEAT SINK

OSEPP Electronics LTD

384 -
RPIHS-03

数据表

- Retail Package Active Heat Spreader Kit, Top Mount Raspberry Pi Square, Fins; Square - - - - Thermal Tape, Adhesive (Included) - - - Copper -
RAS-FANHS10

RAS-FANHS10

COOLING FAN/HS - RASPBERRY PI

Micro Connectors, Inc.

952 -
RAS-FANHS10

数据表

- Retail Package Active Top Mount Raspberry Pi 2B, 3B, 3B+, 4B, B+ Rectangular 1.969" (50.00mm) 1.181" (30.00mm) - 0.295" (7.50mm) Thermal Tape, Adhesive (Included) - - - Aluminum, Plastic -
ATS-51290D-C1-R0

ATS-51290D-C1-R0

HEAT SINK 29MM X 29MM X 9.5MM

Advanced Thermal Solutions Inc.

126 -
ATS-51290D-C1-R0

数据表

maxiGRIP, maxiFLOW Bulk Active Top Mount BGA Square, Angled Fins 1.142" (29.00mm) 1.142" (29.00mm) - 0.374" (9.50mm) Clip, Thermal Material - 7.40°C/W @ 200 LFM - Aluminum Black Anodized
ATS-09F-40-C2-R0

ATS-09F-40-C2-R0

HEATSINK 57.9X60.96X11.43MM T766

Advanced Thermal Solutions Inc.

300 -
ATS-09F-40-C2-R0

数据表

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Rectangular, Fins 2.280" (57.90mm) 2.400" (60.96mm) - 0.450" (11.43mm) Push Pin - 14.56°C/W @ 100 LFM - Aluminum Blue Anodized
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