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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
ATS-21D-20-C2-R0

ATS-21D-20-C2-R0

HEATSINK 54X54X25MM XCUT T766

Advanced Thermal Solutions Inc.

111 -
ATS-21D-20-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.126" (54.00mm) 2.126" (54.00mm) - 0.984" (25.00mm) Push Pin - 7.14°C/W @ 100 LFM - Aluminum Blue Anodized
UNI-H40051-33W/2.6Y

UNI-H40051-33W/2.6Y

AL HEAT SINK 40X40X33MM WITH ELL

Malico Inc.

108 -
UNI-H40051-33W/2.6Y

数据表

Uni-Holder Elliptical Fin Tray Active Top Mount BGA Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 1.181" (30.00mm) Clip - 1.55°C/W @ 200 LFM 6.87°C/W Aluminum Alloy Black Anodized
CS8674510B1

CS8674510B1

45X45X10MM, INTERACE MATERIAL

Cooling Source

286 -
CS8674510B1

数据表

CS86 Box Active Top Mount - Square, Pin Fins 1.772" (45.00mm) 1.772" (45.00mm) - 0.394" (10.00mm) Push Pin, Thermal Material - - - Aluminum Black Anodized
ATS-12B-06-C2-R0

ATS-12B-06-C2-R0

HEATSINK 45X45X10MM XCUT T766

Advanced Thermal Solutions Inc.

300 -
ATS-12B-06-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.772" (45.00mm) 1.772" (45.00mm) - 0.394" (10.00mm) Push Pin - 20.17°C/W @ 100 LFM - Aluminum Blue Anodized
693-75

693-75

HEATSINK TO220 W/CLIP 75MM

Wakefield-Vette

235 -
693-75

数据表

693 Box Active Board Level, Vertical TO-220 Rectangular, Fins 2.953" (75.00mm) 0.870" (22.10mm) - 1.380" (35.05mm) Clip and PC Pin - - - Aluminum Black Anodized
ATS-P1-177-C2-R0

ATS-P1-177-C2-R0

HEATSINK 35X35X20MM R-TAB T766

Advanced Thermal Solutions Inc.

119 -
ATS-P1-177-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.790" (20.00mm) Push Pin - 6.21°C/W @ 100 LFM - Aluminum Blue Anodized
OMNI-220-18-25-1C

OMNI-220-18-25-1C

HEATSINK 18X25MM 1-CLIP TO-220

Wakefield-Vette

2,245 -
OMNI-220-18-25-1C

数据表

OmniKlip™ Tray Active Board Level, Vertical TO-220 Rectangular, Fins 0.984" (25.00mm) 0.710" (18.03mm) - 1.500" (38.10mm) Clip, Solder Foot - - - Aluminum Black Anodized
MBA37.5002-28P/CU/3.2Y

MBA37.5002-28P/CU/3.2Y

CU HEAT SINK 37.5X37.5X28MM WITH

Malico Inc.

117 -
MBA37.5002-28P/CU/3.2Y

数据表

MBA Tray Active Top Mount BGA Square, Pin Fins 1.476" (37.50mm) 1.476" (37.50mm) - 0.984" (25.00mm) Clip - - - Copper -
RAS-HS-A

RAS-HS-A

HEATSINK FOR RASPBERRY PI ALUM

Micro Connectors, Inc.

1,242 -
RAS-HS-A

数据表

- Retail Package Active Top Mount Kit Raspberry Pi 2B, 3B, 3B+, 4B, B+ Rectangular, Fins; Square, Fins - - - - Thermal Tape, Adhesive (Included) - - - Aluminum -
693-100

693-100

HEATSINK TO220 W/CLIP 100MM

Wakefield-Vette

150 -
693-100

数据表

693 Box Active Board Level, Vertical TO-220 Rectangular, Fins 3.937" (100.00mm) 0.870" (22.10mm) - 1.380" (35.05mm) Clip and PC Pin - - - Aluminum Black Anodized
ATS-07E-07-C2-R0

ATS-07E-07-C2-R0

HEATSINK 45X45X12.7MM XCUT T766

Advanced Thermal Solutions Inc.

297 -
ATS-07E-07-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.772" (45.00mm) 1.772" (45.00mm) - 0.500" (12.70mm) Push Pin - 17.00°C/W @ 100 LFM - Aluminum Blue Anodized
OMNI-UNI-34-50

OMNI-UNI-34-50

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

1,948 -
OMNI-UNI-34-50

数据表

OmniKlip™ Bulk Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Fins 1.969" (50.00mm) 1.339" (34.00mm) - 2.953" (75.00mm) Clip, Solder Foot - - - Aluminum Black Anodized
694-75

694-75

HEATSINK TO247 W/CLIP 75MM

Wakefield-Vette

135 -
694-75

数据表

694 Box Active Board Level, Vertical TO-247 Rectangular, Fins 2.953" (75.00mm) 0.870" (22.10mm) - 1.380" (35.05mm) Clip and PC Pin - - - Aluminum Black Anodized
780153U04600G

780153U04600G

78015 4.6

Boyd Laconia, LLC

1,739 -
780153U04600G

数据表

- Bulk Active Board Level, Vertical, Extrusion - Rectangular, Pin Fins - - - 1.969" (50.00mm) Clip and PC Pin - - - Aluminum Alloy -
MBA42.5002-15P/CU/2.6Y

MBA42.5002-15P/CU/2.6Y

CU HEAT SINK 42.5X42.5X15MM WITH

Malico Inc.

121 -
MBA42.5002-15P/CU/2.6Y

数据表

MBA Tray Active Top Mount BGA Square, Pin Fins 1.673" (42.50mm) 1.673" (42.50mm) - 0.472" (12.00mm) Clip - - - Copper -
OMNI-UNI-18-50

OMNI-UNI-18-50

HEATSINK 18X50MM TO-247 TO-264

Wakefield-Vette

1,991 -
OMNI-UNI-18-50

数据表

OmniKlip™ Tray Active Board Level, Vertical TO-247, TO-264 Rectangular, Fins 1.969" (50.00mm) 0.710" (18.03mm) - 1.500" (38.10mm) Clip, Solder Foot - - - Aluminum Black Anodized
ATS-55290R-C0-R0

ATS-55290R-C0-R0

HEATSINK 29X29X19.5MM W/OUT TIM

Advanced Thermal Solutions Inc.

2,484 -
ATS-55290R-C0-R0

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.142" (29.00mm) 1.142" (29.00mm) - 0.768" (19.50mm) Thermal Tape, Adhesive (Not Included) - 5.50°C/W @ 200 LFM - Aluminum Black Anodized
OMNI-UNI-30-75-D

OMNI-UNI-30-75-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

494 -
OMNI-UNI-30-75-D

数据表

OmniKlip™ Bulk Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Fins 2.953" (75.00mm) 1.181" (30.00mm) - 2.362" (60.00mm) Clip, Solder Foot - - - Aluminum Black Anodized
960-31-23-F-AB-0

960-31-23-F-AB-0

HEATSINK 31X23MM FRONT PUSH PIN

Wakefield-Vette

374 -
960-31-23-F-AB-0

数据表

960 Box Active Top Mount BGA Square, Pin Fins 1.220" (31.00mm) 1.220" (31.00mm) - 0.905" (23.00mm) Push Pin - 2.70°C/W @ 200 LFM - Aluminum Black Anodized
ATS-14G-127-C2-R0

ATS-14G-127-C2-R0

HEATSINK 54X54X20MM XCUT T766

Advanced Thermal Solutions Inc.

299 -
ATS-14G-127-C2-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.126" (54.00mm) 2.126" (54.00mm) - 0.790" (20.00mm) Push Pin - 3.84°C/W @ 100 LFM - Aluminum Blue Anodized
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