| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
6296BG PINSHTSK-AL-16372-25.4-B-PINS-(ML97/ Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220 | Rectangular, Fins | 1.650" (41.91mm) | 0.992" (25.20mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | - | - | 5.23°C/W | Aluminum | Black Anodized |
|
530862B05162/MOD.HOLEG202337-0002 REV B Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
10-6327-01G + T725 PAD10-6327-01G + T725 PAD Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA, FPGA | Square, Pin Fins | 1.122" (28.50mm) | 1.122" (28.50mm) | - | 0.394" (10.00mm) | Push Pin | 1.0W @ 30°C | 8.00°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
66100-2167HEAT SINK(RD002371)66100-2167 RE Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
371924B00034GH/S ASS'Y 35*35*13.97MM PGA,3719 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA, FPGA | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.550" (13.97mm) | Thermal Tape, Adhesive (Not Included) | 3.0W @ 60°C | 4.00°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
3293-13293-2,REV A(GP) Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
SW25-4GTHM,ZA3288 ISS 5 SW25-4 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220, TO-247 | Rectangular, Fins | 0.492" (12.50mm) | 1.359" (34.50mm) | - | 0.984" (25.00mm) | Bolt On and PC Pin | 2.0W @ 30°C | 6.50°C/W @ 200 LFM | 11.40°C/W | Aluminum | Black Anodized |
|
476400U00000GBFIN,476400U00000G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
342949-COPPER SKIVFIN342949 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA, FPGA | Square, Fins | 3.150" (80.00mm) | 3.150" (80.00mm) | - | 0.472" (12.00mm) | Push Pin, Thermal Material | - | - | - | Copper | - |
|
6032B-TTGTHM,10824B-TT REV U(COPPER)G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.380" (35.05mm) | 0.500" (12.70mm) | - | 2.000" (50.80mm) | Bolt On and PC Pin | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | - | Copper | Black Anodized |