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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
M47059B011000G

M47059B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

896 -
M47059B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 0.591" (15.00mm) 0.764" (19.40mm) - 1.240" (31.50mm) Clip and PC Pin - - - Aluminum Black Anodized
V2030A

V2030A

HEATSINK CPU FORGED

Assmann WSW Components

1,715 -
V2030A

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.256" (6.50mm) Thermal Tape, Adhesive (Not Included) - - 6.50°C/W Aluminum Alloy Clean Finished
591202B00000G

591202B00000G

HEATSINK TO-220 VERT/HORZ MOUNT

Boyd Laconia, LLC

3,034 -
591202B00000G

数据表

- Bag Active Board Level TO-220, TO-262 Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
311505B00000G

311505B00000G

TO-5 PUSH-ON HEATSINK

Boyd Laconia, LLC

336 -
311505B00000G

数据表

- Bulk Active Board Level TO-5 Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD 0.400" (10.16mm) Press Fit 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Aluminum Black Anodized
574902B00000G

574902B00000G

HEATSINK TO-220 CLIP-ON

Boyd Laconia, LLC

1,302 -
574902B00000G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
658-25ABT1E

658-25ABT1E

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

2,111 -
658-25ABT1E

数据表

658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
M47079B011000G

M47079B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

546 -
M47079B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 0.790" (20.07mm) 0.764" (19.40mm) - 1.240" (31.50mm) Clip and PC Pin - - - Aluminum Black Anodized
7021B-MTG

7021B-MTG

HEATSINK TO-220 TAB FOLD 42.16MM

Boyd Laconia, LLC

6,795 -
7021B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.380" (9.65mm) Bolt On and PC Pin 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
7-339-3PP-BA

7-339-3PP-BA

HEATSINK PWR W/PINS BLACK TO-220

CTS Thermal Management Products

3,395 -
7-339-3PP-BA

数据表

7 Box Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 6.0W @ 40°C - 7.00°C/W Aluminum Black Anodized
TGH-0250-01

TGH-0250-01

ALUMINIUM HEAT SINK 25X25MM

t-Global Technology

143 -
TGH-0250-01

数据表

TGH Bulk Active Top Mount - Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.354" (9.00mm) - - - - Aluminum -
TGH-0300-04

TGH-0300-04

ALUMINIUM HEAT SINK 30X30MM

t-Global Technology

105 -
TGH-0300-04

数据表

TGH Bulk Active Top Mount - Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.591" (15.01mm) - - - - Aluminum -
HSE08-505028

HSE08-505028

HEAT SINK, EXTRUSION, TO-218/TO-

Same Sky (Formerly CUI Devices)

699 -
HSE08-505028

数据表

HSE Bag Active Board Level TO-218, TO-220 Rectangular, Angled Fins 1.969" (50.00mm) 1.102" (28.00mm) - 1.969" (50.00mm) Clip 10.53W @ 75°C 2.70°C/W @ 200 LFM 7.13°C/W Aluminum Alloy Black Anodized
V2032N

V2032N

HEATSINK CPU FORGED

Assmann WSW Components

1,396 -
V2032N

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.728" (18.50mm) Thermal Tape, Adhesive (Not Included) - - 5.00°C/W Aluminum Alloy Natural Anodized
ATS-FPX054054013-17-C1-R0

ATS-FPX054054013-17-C1-R0

HEATSINK 54X54X12.7MM XCUT FP

Advanced Thermal Solutions Inc.

3,899 -
ATS-FPX054054013-17-C1-R0

数据表

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 2.126" (54.00mm) 2.126" (54.00mm) - 0.500" (12.70mm) Push Pin - 15.42°C/W @ 100 LFM - Aluminum Blue Anodized
658-35ABT3

658-35ABT3

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

1,023 -
658-35ABT3

数据表

658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.350" (8.89mm) Thermal Tape, Adhesive (Included) - 3.00°C/W @ 800 LFM - Aluminum Black Anodized
V2276E1

V2276E1

CPU HEATSINK, CROSS CUT, AL6063,

Assmann WSW Components

345 -
V2276E1

数据表

- Bulk Active Top Mount - Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.984" (25.00mm) Thermal Tape, Adhesive (Not Included) - - 19.50°C/W Aluminum Alloy Black Anodized
V4330F

V4330F

HEATSINK ALUM ANOD

Assmann WSW Components

236 -
V4330F

数据表

- Bulk Active Board Level KLP Rectangular, Fins 1.969" (50.00mm) 1.142" (29.00mm) - 0.453" (11.50mm) Bolt On - - 10.00°C/W Aluminum Black Anodized
577002B04000G

577002B04000G

HEATSINK TO-220 W/TAB .25

Boyd Laconia, LLC

1,060 -
577002B04000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) Bolt On and PC Pin 1.5W @ 50°C 16.00°C/W @ 200 LFM 32.00°C/W Aluminum Black Anodized
HSE07-753045

HSE07-753045

HEAT SINK, EXTRUSION, TO-218/TO-

Same Sky (Formerly CUI Devices)

935 -
HSE07-753045

数据表

HSE Bag Active Board Level TO-218, TO-220 Rectangular, Fins 2.953" (75.00mm) 1.181" (30.00mm) - 1.772" (45.00mm) Clip 15.46W @ 75°C 2.10°C/W @ 200 LFM 4.85°C/W Aluminum Alloy Black Anodized
HSE09-755028

HSE09-755028

HEAT SINK, EXTRUSION, TO-218/TO-

Same Sky (Formerly CUI Devices)

965 -
HSE09-755028

数据表

HSE Bag Active Board Level TO-218, TO-220 Rectangular, Angled Fins 2.953" (75.00mm) 1.102" (28.00mm) - 1.969" (50.00mm) Clip 13.26W @ 75°C 2.50°C/W @ 200 LFM 5.66°C/W Aluminum Alloy Black Anodized
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