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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
273-AB

273-AB

HEATSINK TO-220 LOW HEIGHT BLK

Wakefield-Vette

6,688 -
273-AB

数据表

273 Bulk Active Board Level TO-220, TO-218 Rectangular, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.375" (9.52mm) Bolt On 2.0W @ 49°C 7.20°C/W @ 400 LFM 24.50°C/W Aluminum Black Anodized
V2016B

V2016B

HEATSINK CPU XCUT

Assmann WSW Components

25,739 -
V2016B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.335" (8.50mm) 0.335" (8.50mm) - 0.315" (8.00mm) Thermal Tape, Adhesive (Not Included) - - 32.00°C/W Aluminum Alloy Black Anodized
290-2AB

290-2AB

HEATSINK TO-220 DUAL MNT BLK

Wakefield-Vette

6,693 -
290-2AB

数据表

290 Bulk Active Board Level TO-218, TO-202, TO-220 (Dual) Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
V7237C

V7237C

HEATSINK TO-220 19.05X13.21MM

Assmann WSW Components

3,624 -
V7237C

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) Bolt On and PC Pin - - 21.00°C/W Aluminum Black Anodized
V8508G

V8508G

HEATSINK TO-220 15X12.8MM

Assmann WSW Components

18,498 -
V8508G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.591" (15.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) Press Fit 3.0W @ 60°C 14.00°C/W @ 200 LFM - Aluminum Black Anodized
ATS-PCBT1085

ATS-PCBT1085

HEATSINK TO-220 CLIP-ON

Advanced Thermal Solutions Inc.

5,042 -
ATS-PCBT1085

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.504" (12.80mm) Clip - 4.40°C/W @ 200 LFM 27.30°C/W Aluminum Black Anodized
XL25W-TO247-22-17-1

XL25W-TO247-22-17-1

CERAMIC HEAT SPREADER 22X17MM WH

t-Global Technology

1,362 -
XL25W-TO247-22-17-1

数据表

XL-25 Bulk Active Heat Spreader TO-247 Rectangular 0.866" (22.00mm) 0.669" (17.00mm) - 0.039" (1.00mm) Thermal Tape - - - Ceramic -
579302B00000G

579302B00000G

HEATSINK TO-220 SNAP-DOWN .75"

Boyd Laconia, LLC

8,413 -
579302B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.980" (24.89mm) - 0.440" (11.18mm) Clip 3.0W @ 50°C 6.00°C/W @ 500 LFM 16.80°C/W Aluminum Black Anodized
HSS-B20-0635H-01

HSS-B20-0635H-01

HEATSINK TO-220 2.7W ALUMINUM

Same Sky (Formerly CUI Devices)

4,399 -
HSS-B20-0635H-01

数据表

HSS Bag Active Board Level, Vertical TO-220 Rectangular, Fins 0.520" (13.20mm) 0.375" (9.53mm) - 0.748" (19.00mm) PC Pin 2.7W @ 75°C 9.51°C/W @ 200 LFM 27.78°C/W Aluminum Black Anodized
230-75AB

230-75AB

HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette

3,232 -
230-75AB

数据表

230 Bulk Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.570" (14.47mm) - 0.500" (12.70mm) Bolt On 2.0W @ 57°C 7.50°C/W @ 400 LFM 28.50°C/W Aluminum Black Anodized
XL25W-TO247-22-17-0.64

XL25W-TO247-22-17-0.64

CERAMIC HEAT SPREADER 22X17MM WH

t-Global Technology

1,614 -
XL25W-TO247-22-17-0.64

数据表

XL-25 Bulk Active Heat Spreader TO-247 Rectangular 0.866" (22.00mm) 0.669" (17.00mm) - 0.025" (0.64mm) Thermal Tape - - - Ceramic -
575002B00000G

575002B00000G

HEATSINK TO-220 TABS BLACK

Boyd Laconia, LLC

4,977 -
575002B00000G

数据表

- Bag Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 5.00°C/W @ 400 LFM 13.60°C/W Aluminum Black Anodized
217-36CTE6

217-36CTE6

HEATSINK DPAK SMT TIN PLATED

Wakefield-Vette

7,879 -
217-36CTE6

数据表

217 Bulk Active Top Mount D²Pak (TO-263), SOL-20, SOT-223, TO-220 Rectangular, Fins 0.740" (18.80mm) 0.600" (15.24mm) - 0.360" (9.14mm) SMD Pad 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Copper Tin
V8508B-L

V8508B-L

HEATSINK TO-220 19X12.8MM

Assmann WSW Components

1,381 -
V8508B-L

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) Press Fit and PC Pin - - 21.00°C/W Aluminum Black Anodized
V8508H

V8508H

HEAT SINK ANOD ALUM TO-220

Assmann WSW Components

2,579 -
V8508H

数据表

- Bulk Active Top Mount TO-220 Square, Pin Fins 0.591" (15.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) PC Pin - - 26.00°C/W Aluminum Black Anodized
HSS-B20-NP-04

HSS-B20-NP-04

HEATSINK TO-220 6.5W ALUMINUM

Same Sky (Formerly CUI Devices)

5,572 -
HSS-B20-NP-04

数据表

HSS Box Active Board Level TO-220 Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.370" (9.40mm) Bolt On 6.5W @ 75°C 3.76°C/W @ 200 LFM 11.54°C/W Aluminum Black Anodized
291-H36AB

291-H36AB

HEATSINK TO-220 BOLT-ON BLK

Wakefield-Vette

5,196 -
291-H36AB

数据表

291 Bulk Active Board Level TO-220 Rectangular, Fins 0.860" (21.84mm) 1.000" (25.40mm) - 0.360" (9.14mm) Bolt On 2.0W @ 68°C 16.00°C/W @ 600 LFM 34.00°C/W Aluminum Black Anodized
HSS-B20-NPR-02

HSS-B20-NPR-02

HEATSINK TO-220 5.1W ALUMINUM

Same Sky (Formerly CUI Devices)

2,648 -
HSS-B20-NPR-02

数据表

HSS Bag Active Board Level, Vertical TO-220 Rectangular, Fins 0.500" (12.70mm) 1.000" (25.40mm) - 1.180" (29.97mm) Bolt On and Board Mounts 5.1W @ 75°C 4.20°C/W @ 200 LFM 14.71°C/W Aluminum Black Anodized
217-36CTRE6

217-36CTRE6

BOARD LEVEL HEAT SINKS

Wakefield-Vette

2,120 -
217-36CTRE6

数据表

217 Tape & Reel (TR) Active Top Mount D²Pak (TO-263), SOL-20, SOT-223, TO-220 Rectangular, Fins 0.740" (18.80mm) 0.600" (15.24mm) - 0.360" (9.14mm) SMD Pad 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Copper Tin
HSB02-101007

HSB02-101007

HEAT SINK, BGA, 10 X 10 X 7 MM

Same Sky (Formerly CUI Devices)

2,105 -
HSB02-101007

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) Adhesive (Not Included) 2.0W @ 75°C 16.50°C/W @ 200 LFM 37.90°C/W Aluminum Alloy Black Anodized
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