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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-952-41-008000

116-43-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-952-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-964-41-008000

116-41-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-964-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-964-41-008000

116-91-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-964-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-244-31-018000

714-43-244-31-018000

CONN IC DIP SOCKET 44POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-244-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
614-41-964-41-001000

614-41-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-964-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-964-41-001000

614-91-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-964-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-441-21-000101

510-83-441-21-000101

CONN SOCKET PGA 441POS GOLD

Preci-Dip

0 -
510-83-441-21-000101

数据表

510 Bulk Active PGA 441 (21 x 21) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
28-3508-211

28-3508-211

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3508-211

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
517-83-320-19-131111

517-83-320-19-131111

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
517-83-320-19-131111

数据表

517 Bulk Active PGA 320 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-640-JGG

ICO-640-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-JGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
411-13-264-41-001000

411-13-264-41-001000

SOCKET DUAL IN-LINE SLDRTL 64POS

Mill-Max Manufacturing Corp.

0 -
411-13-264-41-001000

数据表

411 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
116-93-210-61-001000

116-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-210-61-001000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-952-41-001000

612-93-952-41-001000

SOCKET CARRIER SLDRTL .900 52POS

Mill-Max Manufacturing Corp.

0 -
612-93-952-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-952-41-001000

612-43-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-952-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-424-61-001000

110-93-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-424-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0508-G-38

HLS-0508-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0508-G-38

数据表

HLS Bulk Active SIP 40 (5 x 8) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APH-0440-T-R

APH-0440-T-R

APH-0440-T-R

Samtec Inc.

0 -
APH-0440-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0940-T-R

APH-0940-T-R

APH-0940-T-R

Samtec Inc.

0 -
APH-0940-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0640-T-R

APH-0640-T-R

APH-0640-T-R

Samtec Inc.

0 -
APH-0640-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0740-T-R

APH-0740-T-R

APH-0740-T-R

Samtec Inc.

0 -
APH-0740-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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