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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
546-83-169-17-101136

546-83-169-17-101136

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
546-83-169-17-101136

数据表

546 Bulk Active PGA 169 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
122-13-328-41-801000

122-13-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-13-328-41-801000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
546-87-223-18-091135

546-87-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
546-87-223-18-091135

数据表

546 Bulk Active PGA 223 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-87-223-18-091136

546-87-223-18-091136

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
546-87-223-18-091136

数据表

546 Bulk Active PGA 223 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
ICA-640-ZHGT

ICA-640-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZHGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
115-44-648-61-003000

115-44-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-648-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-628-G-T

APO-628-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-G-T

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
115-43-428-61-003000

115-43-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-428-61-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-428-61-003000

115-93-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-428-61-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-C300-31

24-C300-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
ICA-648-WGG

ICA-648-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
104-13-950-41-770000

104-13-950-41-770000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-950-41-770000

数据表

104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
115-93-314-61-003000

115-93-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-314-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-952-41-780000

104-11-952-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-952-41-780000

数据表

104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
115-44-324-61-003000

115-44-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-324-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-650-41-004000

612-41-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-650-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-650-41-004000

612-91-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-650-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-952-61-001000

110-44-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-952-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-952-61-001000

110-99-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-952-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
415-13-264-41-001000

415-13-264-41-001000

SOCKET DUAL INLINE LOW PRO 64POS

Mill-Max Manufacturing Corp.

0 -
415-13-264-41-001000

数据表

415 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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