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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
40-8620-610C

40-8620-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-8620-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-8785-310C

40-8785-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-8785-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-8785-610C

40-8785-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-8785-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-8800-610C

40-8800-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-8800-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-8810-610C

40-8810-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-8810-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
123-11-636-41-001000

123-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-636-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
517-83-304-14-051111

517-83-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0 -
517-83-304-14-051111

数据表

517 Bulk Active PGA 304 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
714-93-164-31-007000

714-93-164-31-007000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-93-164-31-007000

数据表

714 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-320-G-R

APO-320-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-G-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
APH-1416-G-H

APH-1416-G-H

APH-1416-G-H

Samtec Inc.

0 -
APH-1416-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1916-G-H

APH-1916-G-H

APH-1916-G-H

Samtec Inc.

0 -
APH-1916-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0416-G-H

APH-0416-G-H

APH-0416-G-H

Samtec Inc.

0 -
APH-0416-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1716-G-H

APH-1716-G-H

APH-1716-G-H

Samtec Inc.

0 -
APH-1716-G-H

数据表

* - Active - - - - - - - - - - - - - - -
28-6556-21

28-6556-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
28-6556-31

28-6556-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
124-41-648-41-002000

124-41-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-648-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-648-41-002000

124-91-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-648-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-93-642-41-002000

124-93-642-41-002000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
124-93-642-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-43-642-41-002000

124-43-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-43-642-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-169-17-101135

546-83-169-17-101135

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
546-83-169-17-101135

数据表

546 Bulk Active PGA 169 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
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